IS61LV12816L-10TLI

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Mfr.Part #
IS61LV12816L-10TLI
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
44-TSOP (0.400, 10.16mm Width)
Datasheet
Download
Description
IC SRAM 2MBIT PARALLEL 44TSOP II
Stock
21,782
In Stock :
21,782

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Standby Current-Max :
0.004A
Packaging :
Tray
JESD-609 Code :
e3
Memory Size :
2Mb 128K x 16
Length :
18.52mm
Pin Count :
44
Width :
10.29mm
Supply Voltage-Min (Vsup) :
2.97V
Output Characteristics :
3-STATE
Number of Terminations :
44
Package / Case :
44-TSOP (0.400, 10.16mm Width)
Lead Free :
Lead Free
Mounting Type :
Surface Mount
Memory Format :
SRAM
Number of Pins :
44
Density :
2 Mb
Memory Interface :
Parallel
Terminal Pitch :
0.8mm
Terminal Position :
Dual
Supply Voltage-Max (Vsup) :
3.63V
RoHS Status :
ROHS3 Compliant
Supply Voltage :
3.3V
Address Bus Width :
17b
Pbfree Code :
yes
Number of Functions :
1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
I/O Type :
COMMON
Write Cycle Time - Word, Page :
10ns
Radiation Hardening :
No
Mount :
Surface Mount
Operating Supply Voltage :
3.3V
Terminal Finish :
Matte Tin (Sn) - annealed
Nominal Supply Current :
65mA
Memory Type :
Volatile
Operating Temperature :
-40°C~85°C TA
Height :
1.05mm
Word Size :
16b
Sync/Async :
ASYNCHRONOUS
Voltage - Supply :
3.135V~3.6V
Number of Ports :
1
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61LV12816L-10TLI from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:44, Package / Case:44-TSOP (0.400, 10.16mm Width), Mounting Type:Surface Mount, Number of Pins:44, Operating Temperature:-40°C~85°C TA, IS61LV12816L-10TLI pinout, IS61LV12816L-10TLI datasheet PDF, IS61LV12816L-10TLI amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61LV12816L-10TLI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61LV12816L-10TLI


Memory Integrated Silicon Solution, Inc. (ISSI) IS61LV12816L-10TLI Overview

The Memory Integrated Silicon Solution, Inc. (ISSI) IS61LV12816L-10TLI is a high-performance 2Mbit Static Random Access Memory (SRAM) designed for fast access and reliable data storage. Engineered using ISSI's cutting-edge technology, this memory module is housed in a compact 44-pin TSOP II package, offering robust environmental endurance and operational stability. It operates at a speed of 10ns, making it an excellent choice for applications requiring high-speed data processing and low-latency access. Its high density and ease of integration make it particularly suitable for a broad range of industrial and commercial applications.

IS61LV12816L-10TLI Features

  • Capacity: 2Mbit of high-speed SRAM, providing ample space for critical applications requiring quick data retrieval.
  • Package: Utilizes a 44-pin TSOP II package, known for its small form factor and compatibility with standard PCB layouts.
  • Speed: Fast access time of 10ns, facilitating operations that require rapid memory access to enhance system responsiveness.
  • Operating Voltage: Operates on a single 3.3V power supply, which reduces power consumption while maintaining performance.
  • Temperature Range: Suitable for industrial applications with an operating temperature range from -40°C to +85°C, ensuring reliability under extreme conditions.

IS61LV12816L-10TLI Applications

  • Networking Equipment: Used in routers and switches for buffer memory, where quick data access is crucial for managing network traffic efficiently.
  • Automotive Electronics: Ideal for automotive applications where durability and reliable data storage are needed for engine control units and infotainment systems.
  • Industrial Automation: Serves as process memory in PLCs and other automation controllers, optimizing operations and system monitoring.
  • Medical Devices: Utilized in medical imaging systems to ensure rapid processing and retrieval of diagnostic information, enhancing device performance.
  • Telecommunications: Applied in telecommunications infrastructure to support high-speed data transmission and signal processing tasks.
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