IS61LPS51236A-200B3I

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Mfr.Part #
IS61LPS51236A-200B3I
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165TFBGA
Stock
18,780
In Stock :
18,780

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Power Supplies :
2.5/3.33.3V
Operating Temperature :
-40°C~85°C TA
Number of Terminations :
165
Clock Frequency :
200MHz
Package / Case :
165-TBGA
Width :
13mm
Terminal Finish :
Tin/Lead (Sn/Pb)
Memory Type :
Volatile
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Memory Width :
36
Memory Density :
18874368 bit
Memory Size :
18Mb 512K x 36
Voltage - Supply :
3.135V~3.465V
Packaging :
Tray
Pbfree Code :
No
Output Characteristics :
3-STATE
Additional Feature :
PIPELINED ARCHITECTURE
Number of Functions :
1
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Supply Voltage-Max (Vsup) :
3.465V
Standby Current-Max :
0.125A
ECCN Code :
3A991.B.2.A
HTS Code :
8542.32.00.41
Organization :
512KX36
Memory Format :
SRAM
Surface Mount :
yes
Supply Current-Max :
0.475mA
Pin Count :
165
Length :
15mm
Supply Voltage :
3.3V
Terminal Position :
BOTTOM
Height Seated (Max) :
1.2mm
I/O Type :
COMMON
Supply Voltage-Min (Vsup) :
3.135V
Number of Pins :
165
Standby Voltage-Min :
3.14V
Qualification Status :
Not Qualified
Terminal Pitch :
1mm
JESD-609 Code :
e0
Memory Interface :
Parallel
Access Time :
3.1ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS51236A-200B3I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Number of Terminations:165, Package / Case:165-TBGA, Mounting Type:Surface Mount, Number of Pins:165, IS61LPS51236A-200B3I pinout, IS61LPS51236A-200B3I datasheet PDF, IS61LPS51236A-200B3I amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS51236A-200B3I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61LPS51236A-200B3I


Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS51236A-200B3I Overview

The Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS51236A-200B3I is a high-performance 18Mbit SRAM chip designed for applications requiring fast and reliable data storage and retrieval. This SRAM module utilizes advanced CMOS technology, offering a dense, high-speed memory solution that is optimized for energy efficiency and high-speed operation. Its 165-pin TFBGA package ensures a compact footprint while providing robust parallel interface options, making it an excellent choice for embedding into a variety of high-demand systems. The incorporation of this Memory ISSI product can significantly enhance system reliability and performance, particularly in environments where quick access to large volumes of data is critical.

IS61LPS51236A-200B3I Features

This SRAM features a parallel interface, allowing for quick and efficient data handling capabilities. It operates at 200 MHz, providing the necessary speed for high-performance computing tasks. The compact 165TFBGA packaging not only minimizes space on printed circuit boards but also enhances the thermal characteristics, making the IS61LPS51236A-200B3I suitable for systems where operational integrity is paramount under varying thermal conditions.

IS61LPS51236A-200B3I Applications

  • Networking Equipment: Utilized in routers, switches, and other networking devices to enhance data buffer management and improve overall device throughput.
  • Telecommunications: Critical for use in telecom infrastructure, where high-speed data transmission and reception require robust, reliable memory solutions.
  • Industrial Automation: Supports complex, real-time processing tasks in PLCs and other control systems, enabling faster response times and increased reliability.
  • Automotive: Employed in advanced driver-assistance systems (ADAS) to facilitate rapid data processing, helping to improve vehicle safety and performance.
  • High-Performance Computing: Ideal for use in servers and supercomputers where large volumes of data need to be accessed swiftly to maintain system efficiency.
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