IS61LPS51236A-200B3I
- Mfr.Part #
- IS61LPS51236A-200B3I
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 18,780
- In Stock :
- 18,780
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Power Supplies :
- 2.5/3.33.3V
- Operating Temperature :
- -40°C~85°C TA
- Number of Terminations :
- 165
- Clock Frequency :
- 200MHz
- Package / Case :
- 165-TBGA
- Width :
- 13mm
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Memory Type :
- Volatile
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Surface Mount
- Memory Width :
- 36
- Memory Density :
- 18874368 bit
- Memory Size :
- 18Mb 512K x 36
- Voltage - Supply :
- 3.135V~3.465V
- Packaging :
- Tray
- Pbfree Code :
- No
- Output Characteristics :
- 3-STATE
- Additional Feature :
- PIPELINED ARCHITECTURE
- Number of Functions :
- 1
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Supply Voltage-Max (Vsup) :
- 3.465V
- Standby Current-Max :
- 0.125A
- ECCN Code :
- 3A991.B.2.A
- HTS Code :
- 8542.32.00.41
- Organization :
- 512KX36
- Memory Format :
- SRAM
- Surface Mount :
- yes
- Supply Current-Max :
- 0.475mA
- Pin Count :
- 165
- Length :
- 15mm
- Supply Voltage :
- 3.3V
- Terminal Position :
- BOTTOM
- Height Seated (Max) :
- 1.2mm
- I/O Type :
- COMMON
- Supply Voltage-Min (Vsup) :
- 3.135V
- Number of Pins :
- 165
- Standby Voltage-Min :
- 3.14V
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 1mm
- JESD-609 Code :
- e0
- Memory Interface :
- Parallel
- Access Time :
- 3.1ns
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- IS61LPS51236A-200B3I
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS51236A-200B3I Overview
The Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS51236A-200B3I is a high-performance 18Mbit SRAM chip designed for applications requiring fast and reliable data storage and retrieval. This SRAM module utilizes advanced CMOS technology, offering a dense, high-speed memory solution that is optimized for energy efficiency and high-speed operation. Its 165-pin TFBGA package ensures a compact footprint while providing robust parallel interface options, making it an excellent choice for embedding into a variety of high-demand systems. The incorporation of this Memory ISSI product can significantly enhance system reliability and performance, particularly in environments where quick access to large volumes of data is critical.
IS61LPS51236A-200B3I Features
This SRAM features a parallel interface, allowing for quick and efficient data handling capabilities. It operates at 200 MHz, providing the necessary speed for high-performance computing tasks. The compact 165TFBGA packaging not only minimizes space on printed circuit boards but also enhances the thermal characteristics, making the IS61LPS51236A-200B3I suitable for systems where operational integrity is paramount under varying thermal conditions.
IS61LPS51236A-200B3I Applications
- Networking Equipment: Utilized in routers, switches, and other networking devices to enhance data buffer management and improve overall device throughput.
- Telecommunications: Critical for use in telecom infrastructure, where high-speed data transmission and reception require robust, reliable memory solutions.
- Industrial Automation: Supports complex, real-time processing tasks in PLCs and other control systems, enabling faster response times and increased reliability.
- Automotive: Employed in advanced driver-assistance systems (ADAS) to facilitate rapid data processing, helping to improve vehicle safety and performance.
- High-Performance Computing: Ideal for use in servers and supercomputers where large volumes of data need to be accessed swiftly to maintain system efficiency.
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