IS61LPS102418A-250B3
- Mfr.Part #
- IS61LPS102418A-250B3
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 34,447
- In Stock :
- 34,447
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Qualification Status :
- Not Qualified
- ECCN Code :
- 3A991.B.2.A
- Memory Format :
- SRAM
- I/O Type :
- COMMON
- Memory Size :
- 18Mb 1M x 18
- Output Characteristics :
- 3-STATE
- Voltage - Supply :
- 3.135V~3.465V
- Supply Current-Max :
- 0.45mA
- HTS Code :
- 8542.32.00.41
- Standby Voltage-Min :
- 3.14V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Supply Voltage-Max (Vsup) :
- 3.465V
- RoHS Status :
- ROHS3 Compliant
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Length :
- 15mm
- Height Seated (Max) :
- 1.2mm
- Terminal Pitch :
- 1mm
- Memory Density :
- 18874368 bit
- Packaging :
- Tray
- Terminal Position :
- BOTTOM
- Access Time :
- 2.6ns
- Standby Current-Max :
- 0.11A
- Package / Case :
- 165-TBGA
- Pin Count :
- 165
- Operating Temperature :
- 0°C~70°C TA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Additional Feature :
- PIPELINED ARCHITECTURE
- Mounting Type :
- Surface Mount
- Memory Type :
- Volatile
- Clock Frequency :
- 250MHz
- Number of Pins :
- 165
- Width :
- 13mm
- Power Supplies :
- 2.5/3.33.3V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Memory Width :
- 18
- Organization :
- 1MX18
- Memory Interface :
- Parallel
- Pbfree Code :
- No
- Number of Functions :
- 1
- Supply Voltage-Min (Vsup) :
- 3.135V
- Surface Mount :
- yes
- Number of Terminations :
- 165
- JESD-609 Code :
- e0
- Supply Voltage :
- 3.3V
- Datasheets
- IS61LPS102418A-250B3
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS102418A-250B3 Overview
The IS61LPS102418A-250B3 from Integrated Silicon Solution, Inc. (ISSI) is a high-performance, 18Mbit SRAM chip, encapsulated in a compact 165TFBGA package. This memory module is designed to meet the demanding requirements of high-speed data transmission and storage. With its parallel interface, this SRAM offers efficient integration into a range of advanced electronic systems, ensuring rapid access and reliability essential for mission-critical applications. Its robust architecture and advanced manufacturing deliver enhanced durability and operational stability, making the Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS102418A-250B3 an ideal choice for developers and engineers seeking reliable memory solutions.
IS61LPS102418A-250B3 Features
The IS61LPS102418A-250B3 SRAM chip boasts several key features that make it an outstanding choice for high-performance memory applications:
- High Capacity: 18Mbit of storage ensures ample space for large datasets.
- Speed: Fast access times facilitate high-speed data processing.
- Package: The 165TFBGA package offers a compact footprint suitable for space-constrained applications.
- Interface: Parallel interface allows for straightforward integration into a variety of system architectures.
- Reliability: Built with ISSI's rigorous quality control, the chip provides consistent performance and durability.
IS61LPS102418A-250B3 Applications
- Telecommunications Equipment: Utilized in routers and switches for buffering and data caching to enhance network efficiency and speed.
- Computing: Serves as a high-speed cache or temporary storage in server and high-performance computing applications, optimizing data retrieval and processing.
- Industrial Automation: Employed in automation controllers and real-time systems where rapid data access is critical for process control and monitoring.
- Aerospace and Defense: Used in avionics for data logging and real-time system performance analysis, ensuring robust and reliable operations in demanding environments.
- Medical Devices: Integrated into medical imaging systems to facilitate quick image processing and large data management, improving diagnostic capabilities.
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