IS61LPS102418A-200B3I-TR

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Mfr.Part #
IS61LPS102418A-200B3I-TR
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165TFBGA
Stock
35,449
In Stock :
35,449

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Package / Case :
165-TBGA
Operating Temperature :
-40°C~85°C TA
Packaging :
Tape and Reel (TR)
Clock Frequency :
200MHz
Memory Type :
Volatile
Number of Pins :
165
RoHS Status :
ROHS3 Compliant
Memory Interface :
Parallel
Memory Format :
SRAM
Access Time :
3.1ns
Mounting Type :
Surface Mount
Memory Size :
18Mb 1M x 18
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
3.135V~3.465V
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS102418A-200B3I-TR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-TBGA, Operating Temperature:-40°C~85°C TA, Number of Pins:165, Mounting Type:Surface Mount, IS61LPS102418A-200B3I-TR pinout, IS61LPS102418A-200B3I-TR datasheet PDF, IS61LPS102418A-200B3I-TR amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS102418A-200B3I-TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61LPS102418A-200B3I-TR


Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS102418A-200B3I-TR Overview

The IS61LPS102418A-200B3I-TR from Integrated Silicon Solution, Inc. (ISSI) stands as a pivotal component in advanced memory solutions, designed for high-speed and high-density applications. This IC SRAM unit boasts an impressive 18Mbit capacity and operates on a parallel interface, encapsulated in a compact 165TFBGA package. The design ensures reduced power consumption while maintaining high reliability and performance. Tailored for demanding environments, this Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS102418A-200B3I-TR product is engineered to meet the critical needs of modern electronic systems, making it ideal for B2B customers looking to integrate robust memory components in their bulk purchasing plans.

IS61LPS102418A-200B3I-TR Features

The IS61LPS102418A-200B3I-TR memory chip excels with its high data integrity and low power requirements. It supports a wide range of operating temperatures, making it suitable for versatile applications. The 165TFBGA packaging not only ensures a reduced footprint on the circuit board but also provides enhanced heat dissipation characteristics, crucial for maintaining the longevity and reliability of the device.

IS61LPS102418A-200B3I-TR Applications

  • Advanced Computing Systems: Utilized in servers and high-performance computing systems to handle large volumes of data efficiently.
  • Networking Equipment: Deployed in routers and switches, enhancing the speed and reliability of network communication.
  • Telecommunications Infrastructure: Integral in telecommunications systems for fast processing and storage of information.
  • Automotive Electronics: Applied in automotive systems where robust and reliable memory storage is critical for vehicle safety and functionality.
  • Industrial Automation: Used in industrial control systems to ensure smooth operation and real-time process management.
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