IS61LPS102418A-200B3I
- Mfr.Part #
- IS61LPS102418A-200B3I
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 17,398
- In Stock :
- 17,398
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- HTS Code :
- 8542.32.00.41
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Pin Count :
- 165
- Qualification Status :
- Not Qualified
- Surface Mount :
- yes
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Standby Voltage-Min :
- 3.14V
- Terminal Position :
- BOTTOM
- Clock Frequency :
- 200MHz
- Voltage - Supply :
- 3.135V~3.465V
- Length :
- 15mm
- Pbfree Code :
- No
- Organization :
- 1MX18
- Number of Terminations :
- 165
- Access Time :
- 3.1ns
- Height Seated (Max) :
- 1.2mm
- Power Supplies :
- 2.5/3.33.3V
- Memory Format :
- SRAM
- Package / Case :
- 165-TBGA
- Supply Voltage-Max (Vsup) :
- 3.465V
- Memory Density :
- 18874368 bit
- Standby Current-Max :
- 0.125A
- Supply Voltage :
- 3.3V
- RoHS Status :
- ROHS3 Compliant
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Width :
- 13mm
- Output Characteristics :
- 3-STATE
- Supply Current-Max :
- 0.475mA
- Memory Interface :
- Parallel
- Number of Functions :
- 1
- Operating Temperature :
- -40°C~85°C TA
- ECCN Code :
- 3A991.B.2.A
- Number of Pins :
- 165
- Mounting Type :
- Surface Mount
- Additional Feature :
- PIPELINED ARCHITECTURE
- Terminal Pitch :
- 1mm
- I/O Type :
- COMMON
- Memory Size :
- 18Mb 1M x 18
- JESD-609 Code :
- e0
- Supply Voltage-Min (Vsup) :
- 3.135V
- Memory Width :
- 18
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Type :
- Volatile
- Datasheets
- IS61LPS102418A-200B3I
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS102418A-200B3I Overview
The Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS102418A-200B3I is a high-performance 18Mbit SRAM chip, engineered for speed and reliability. Designed using the latest semiconductor technology, this product offers a robust parallel interface and is encapsulated in a compact 165TFBGA package. The integration of advanced circuitry ensures minimal power consumption while maintaining high data integrity, making it ideal for demanding applications where space and power efficiency are critical. Its high-speed data access capabilities make it an excellent choice for enhancing the performance of embedded systems.
IS61LPS102418A-200B3I Features
This SRAM device boasts a large 18Mbit capacity with a fast access time, provided by its efficient parallel interface. The 165TFBGA packaging not only ensures a reduced footprint on system boards but also aids in superior thermal management. Furthermore, its design is tailored for high reliability under extended industrial temperature ranges, making it suitable for a wide variety of demanding environments.
IS61LPS102418A-200B3I Applications
- Advanced Networking Equipment: Utilized in routers and switches to manage data flow efficiently due to its high-speed parallel interface.
- Automotive Electronics: Serves as a reliable memory solution in automotive control systems, where durability and performance under extreme conditions are essential.
- Industrial Automation Systems: Improves responsiveness and reliability in industrial control applications, supporting complex processes and real-time operations.
- Telecommunications Infrastructure: Helps in managing fast data transactions and large volumes of information in telecommunications systems.
- Consumer Electronics: Integrated into consumer electronics such as digital cameras and gaming consoles for quick data buffering and high-speed processing.
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