IS61LPS102418A-200B3
- Mfr.Part #
- IS61LPS102418A-200B3
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 3,670
- In Stock :
- 3,670
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- RoHS Status :
- ROHS3 Compliant
- Memory Width :
- 18
- Memory Format :
- SRAM
- Qualification Status :
- Not Qualified
- Pin Count :
- 165
- Voltage - Supply :
- 3.135V~3.465V
- Number of Functions :
- 1
- Output Characteristics :
- 3-STATE
- Power Supplies :
- 2.5/3.33.3V
- Clock Frequency :
- 200MHz
- Pbfree Code :
- No
- Width :
- 13mm
- Access Time :
- 3.1ns
- Length :
- 15mm
- Number of Terminations :
- 165
- Standby Current-Max :
- 0.125A
- JESD-609 Code :
- e0
- Memory Interface :
- Parallel
- Memory Size :
- 18Mb 1M x 18
- Organization :
- 1MX18
- Packaging :
- Tray
- Supply Voltage :
- 3.3V
- ECCN Code :
- 3A991.B.2.A
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Standby Voltage-Min :
- 3.14V
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Supply Voltage-Min (Vsup) :
- 3.135V
- Mounting Type :
- Surface Mount
- Supply Current-Max :
- 0.475mA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Surface Mount :
- yes
- Operating Temperature :
- -40°C~85°C TA
- Memory Type :
- Volatile
- Package / Case :
- 165-TBGA
- Terminal Position :
- BOTTOM
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Additional Feature :
- PIPELINED ARCHITECTURE
- Height Seated (Max) :
- 1.2mm
- Supply Voltage-Max (Vsup) :
- 3.465V
- I/O Type :
- COMMON
- HTS Code :
- 8542.32.00.41
- Terminal Pitch :
- 1mm
- Number of Pins :
- 165
- Memory Density :
- 18874368 bit
- Datasheets
- IS61LPS102418A-200B3
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS102418A-200B3 Overview
The Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS102418A-200B3 is a cutting-edge SRAM (Static Random Access Memory) chip, featuring a substantial 18Mbit storage capacity. Engineered for high-speed and reliable performance, this memory component utilizes a parallel interface encapsulated in a compact 165TFBGA (Thin Fine-Pitch Ball Grid Array) package. This product is specifically designed to meet the rigorous demands of high-performance computing environments, offering a swift 200 MHz clock speed for efficient data handling and quick access times, making it an ideal choice for sophisticated electronics that require rapid and reliable memory solutions.
IS61LPS102418A-200B3 Features
This SRAM chip excels in delivering high-speed data transfer and low-latency access, critical for applications where rapid processing of large volumes of data is necessary. With its 18Mbit capacity and 200 MHz operational speed, the IS61LPS102418A-200B3 ensures superior performance in data-intensive tasks. The 165TFBGA package not only saves space but also significantly enhances the reliability and durability of the memory chip under various environmental conditions.
IS61LPS102418A-200B3 Applications
- Advanced Computing Systems: Utilized in server farms and data centers requiring fast and reliable data retrieval to handle large-scale processing tasks efficiently.
- Telecommunication Equipment: Key component in telecommunications infrastructure to manage high-speed data transmission and signal processing.
- Automotive Electronics: Employed in advanced driver-assistance systems (ADAS) where quick access to data is vital for real-time decision making.
- Industrial Automation: Integral to control systems in automated manufacturing processes, enhancing precision and speed in operations.
- Medical Devices: Used in medical imaging equipment for fast processing and storage of complex imaging data, contributing to more accurate diagnostics.
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