IS61LPD51236A-200B3I
- Mfr.Part #
- IS61LPD51236A-200B3I
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165PBGA
- Stock
- 32,052
- In Stock :
- 32,052
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Additional Feature :
- PIPELINED ARCHITECTURE
- Number of Terminations :
- 165
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Surface Mount :
- yes
- Number of Pins :
- 165
- Supply Current-Max :
- 0.475mA
- Power Supplies :
- 2.5/3.33.3V
- Pin Count :
- 165
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Format :
- SRAM
- Length :
- 15mm
- Access Time :
- 3.1ns
- Supply Voltage-Min (Vsup) :
- 3.135V
- Mounting Type :
- Surface Mount
- Memory Type :
- Volatile
- Memory Width :
- 36
- Standby Voltage-Min :
- 3.14V
- ECCN Code :
- 3A991.B.2.A
- Number of Functions :
- 1
- Width :
- 13mm
- Voltage - Supply :
- 3.135V~3.465V
- RoHS Status :
- ROHS3 Compliant
- Terminal Position :
- BOTTOM
- Standby Current-Max :
- 0.075A
- Clock Frequency :
- 200MHz
- I/O Type :
- COMMON
- Output Characteristics :
- 3-STATE
- Package / Case :
- 165-TBGA
- Organization :
- 512KX36
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- JESD-609 Code :
- e0
- Memory Interface :
- Parallel
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Supply Voltage-Max (Vsup) :
- 3.465V
- Operating Temperature :
- -40°C~85°C TA
- Pbfree Code :
- No
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 1mm
- Memory Density :
- 18874368 bit
- Memory Size :
- 18Mb 512K x 36
- Height Seated (Max) :
- 1.2mm
- Packaging :
- Tray
- HTS Code :
- 8542.32.00.41
- Supply Voltage :
- 3.3V
- Datasheets
- IS61LPD51236A-200B3I

Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD51236A-200B3I Overview
The Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD51236A-200B3I represents a pinnacle in high-speed, high-capacity SRAM technology, offering 18Mbit of storage, organized in a sophisticated parallel interface structure. This product, housed in a compact 165PBGA package, is engineered for optimal efficiency and reliability, catering to the demands of advanced, high-performance computing systems. It is designed to deliver exceptional speed with a configuration that supports a synchronous operation, making it an ideal choice for applications requiring rapid access to large volumes of data. The robust build and advanced manufacturing techniques ensure enhanced durability and operational stability under varied environmental conditions.
IS61LPD51236A-200B3I Features
This high-quality SRAM chip features a 200 MHz clock speed, parallel data interface, and a stable industrial temperature range of -40°C to 85°C, ensuring reliable performance in demanding applications. Its low-latency, high-throughput capabilities make it exceptionally well-suited for intensive tasks that require quick data retrieval and storage.
IS61LPD51236A-200B3I Applications
- Advanced Computing Systems: Utilized in servers and high-performance computers where rapid access to a large amount of data is critical.
- Networking Equipment: Serves as high-speed cache and buffer memory in routers, switches, and networking hubs to manage data flow efficiently.
- Telecommunication Infrastructure: Deployed in telecommunications systems for fast data buffering, helping in the management of network loads and improving the reliability of communication channels.
- Industrial Automation: Applied in control systems for real-time processing of extensive sensor data, optimizing automated industrial processes and operations.
- Aerospace and Defense: Used in aerospace applications and military hardware where robust and reliable memory storage is necessary for mission-critical operations.
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