IS61LPD51236A-200B3I

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Mfr.Part #
IS61LPD51236A-200B3I
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165PBGA
Stock
32,052
In Stock :
32,052

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Additional Feature :
PIPELINED ARCHITECTURE
Number of Terminations :
165
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Surface Mount :
yes
Number of Pins :
165
Supply Current-Max :
0.475mA
Power Supplies :
2.5/3.33.3V
Pin Count :
165
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
SRAM
Length :
15mm
Access Time :
3.1ns
Supply Voltage-Min (Vsup) :
3.135V
Mounting Type :
Surface Mount
Memory Type :
Volatile
Memory Width :
36
Standby Voltage-Min :
3.14V
ECCN Code :
3A991.B.2.A
Number of Functions :
1
Width :
13mm
Voltage - Supply :
3.135V~3.465V
RoHS Status :
ROHS3 Compliant
Terminal Position :
BOTTOM
Standby Current-Max :
0.075A
Clock Frequency :
200MHz
I/O Type :
COMMON
Output Characteristics :
3-STATE
Package / Case :
165-TBGA
Organization :
512KX36
Terminal Finish :
Tin/Lead (Sn/Pb)
JESD-609 Code :
e0
Memory Interface :
Parallel
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Supply Voltage-Max (Vsup) :
3.465V
Operating Temperature :
-40°C~85°C TA
Pbfree Code :
No
Qualification Status :
Not Qualified
Terminal Pitch :
1mm
Memory Density :
18874368 bit
Memory Size :
18Mb 512K x 36
Height Seated (Max) :
1.2mm
Packaging :
Tray
HTS Code :
8542.32.00.41
Supply Voltage :
3.3V
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD51236A-200B3I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:165, Number of Pins:165, Mounting Type:Surface Mount, Package / Case:165-TBGA, Operating Temperature:-40°C~85°C TA, IS61LPD51236A-200B3I pinout, IS61LPD51236A-200B3I datasheet PDF, IS61LPD51236A-200B3I amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD51236A-200B3I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61LPD51236A-200B3I


Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD51236A-200B3I Overview

The Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD51236A-200B3I represents a pinnacle in high-speed, high-capacity SRAM technology, offering 18Mbit of storage, organized in a sophisticated parallel interface structure. This product, housed in a compact 165PBGA package, is engineered for optimal efficiency and reliability, catering to the demands of advanced, high-performance computing systems. It is designed to deliver exceptional speed with a configuration that supports a synchronous operation, making it an ideal choice for applications requiring rapid access to large volumes of data. The robust build and advanced manufacturing techniques ensure enhanced durability and operational stability under varied environmental conditions.

IS61LPD51236A-200B3I Features

This high-quality SRAM chip features a 200 MHz clock speed, parallel data interface, and a stable industrial temperature range of -40°C to 85°C, ensuring reliable performance in demanding applications. Its low-latency, high-throughput capabilities make it exceptionally well-suited for intensive tasks that require quick data retrieval and storage.

IS61LPD51236A-200B3I Applications

  • Advanced Computing Systems: Utilized in servers and high-performance computers where rapid access to a large amount of data is critical.
  • Networking Equipment: Serves as high-speed cache and buffer memory in routers, switches, and networking hubs to manage data flow efficiently.
  • Telecommunication Infrastructure: Deployed in telecommunications systems for fast data buffering, helping in the management of network loads and improving the reliability of communication channels.
  • Industrial Automation: Applied in control systems for real-time processing of extensive sensor data, optimizing automated industrial processes and operations.
  • Aerospace and Defense: Used in aerospace applications and military hardware where robust and reliable memory storage is necessary for mission-critical operations.
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