IS61LPD102418A-200B3I-TR

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Mfr.Part #
IS61LPD102418A-200B3I-TR
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165PBGA
Stock
11,548
In Stock :
11,548

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Memory Format :
SRAM
Packaging :
Tape and Reel (TR)
Clock Frequency :
200MHz
Package / Case :
165-TBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
3.135V~3.465V
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Operating Temperature :
-40°C~85°C TA
Memory Interface :
Parallel
Number of Pins :
165
Memory Size :
18Mb 1M x 18
Access Time :
3.1ns
Memory Type :
Volatile
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD102418A-200B3I-TR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-TBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Number of Pins:165, IS61LPD102418A-200B3I-TR pinout, IS61LPD102418A-200B3I-TR datasheet PDF, IS61LPD102418A-200B3I-TR amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD102418A-200B3I-TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61LPD102418A-200B3I-TR


Memory Integrated Silicon Solution, Inc. IS61LPD102418A-200B3I-TR Overview

The Memory Integrated Silicon Solution, Inc. IS61LPD102418A-200B3I-TR is a high-performance 18Mbit SRAM chip, designed for applications requiring fast access and high bandwidth data retention. Utilizing a parallel interface and housed in a compact 165PBGA package, this SRAM module provides a robust solution for advanced computing and networking systems. Its design is optimized for reliability and speed, supporting the demanding needs of both industrial and commercial applications where quick data retrieval is crucial.

IS61LPD102418A-200B3I-TR Features

This Integrated Circuits device offers numerous technical advantages that enhance system performance. Key features include:

  • High data bandwidth, suitable for intensive data processing tasks.
  • Low-latency access times, enabling faster system response.
  • Energy-efficient design, reducing operational costs and enhancing system sustainability.
  • Durable 165PBGA package, providing robust protection against physical and thermal stress.

IS61LPD102418A-200B3I-TR Applications

  • High-Performance Computing: Utilized in servers and workstations for rapid data access and processing to handle complex computations efficiently.
  • Networking Hardware: Essential for routers and switches, where quick data exchange is critical for maintaining high-speed network performance.
  • Telecommunications Equipment: Supports the high-speed data requirements of telecom infrastructure, ensuring reliable and uninterrupted service.
  • Automotive Electronics: Applied in advanced driver-assistance systems (ADAS) to process real-time data critical for vehicle safety and performance.
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