IS61LPD102418A-200B3I

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Mfr.Part #
IS61LPD102418A-200B3I
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165PBGA
Stock
17,938
In Stock :
17,938

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Voltage - Supply :
3.135V~3.465V
Standby Current-Max :
0.075A
Packaging :
Tray
Organization :
1MX18
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Height Seated (Max) :
1.2mm
Memory Width :
18
Memory Interface :
Parallel
Package / Case :
165-TBGA
Memory Size :
18Mb 1M x 18
Access Time :
3.1ns
Output Characteristics :
3-STATE
Number of Terminations :
165
Operating Temperature :
-40°C~85°C TA
Width :
13mm
Supply Current-Max :
0.475mA
Number of Functions :
1
ECCN Code :
3A991.B.2.A
Terminal Pitch :
1mm
Supply Voltage-Min (Vsup) :
3.135V
Pbfree Code :
No
I/O Type :
COMMON
JESD-609 Code :
e0
Terminal Finish :
Tin/Lead (Sn/Pb)
Qualification Status :
Not Qualified
Standby Voltage-Min :
3.14V
Terminal Position :
BOTTOM
Mounting Type :
Surface Mount
Memory Type :
Volatile
Supply Voltage-Max (Vsup) :
3.465V
Additional Feature :
PIPELINED ARCHITECTURE
Pin Count :
165
Clock Frequency :
200MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
HTS Code :
8542.32.00.41
Memory Density :
18874368 bit
Length :
15mm
Number of Pins :
165
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Surface Mount :
yes
Memory Format :
SRAM
Supply Voltage :
3.3V
RoHS Status :
ROHS3 Compliant
Power Supplies :
2.5/3.33.3V
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD102418A-200B3I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-TBGA, Number of Terminations:165, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Number of Pins:165, IS61LPD102418A-200B3I pinout, IS61LPD102418A-200B3I datasheet PDF, IS61LPD102418A-200B3I amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD102418A-200B3I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61LPD102418A-200B3I


Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD102418A-200B3I Overview

The Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD102418A-200B3I is a high-performance 18Mbit SRAM device featuring a parallel interface and housed in a compact 165-pin PBGA package. This memory module is designed to deliver rapid read and write speeds which are crucial for applications requiring high bandwidth and low latency data storage and retrieval. Manufactured by Integrated Silicon Solution, Inc., a leader in advanced memory solutions, this product ensures robust reliability and superior performance for critical systems. The Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPD102418A-200B3I SRAM is ideal for a wide range of industrial and commercial applications, reflecting its versatile capabilities and cutting-edge technology.

IS61LPD102418A-200B3I Features

The IS61LPD102418A-200B3I SRAM offers several distinctive features that make it a top choice for high-performance memory requirements:

  • 18Mbit high-density memory capacity ensures ample space for large datasets and complex programs.
  • Parallel interface facilitates fast data transfer rates, making it suitable for high-speed computing tasks.
  • The compact 165-pin PBGA (Plastic Ball Grid Array) package provides a space-efficient solution while maintaining robustness and reliability.
  • Designed for easy integration into a variety of circuit boards and systems.
  • Low power consumption and high reliability enhance its suitability for sustained performance in critical applications.

IS61LPD102418A-200B3I Applications

  • Advanced Computing Systems: Utilized in servers and high-performance computing platforms for fast processing and data manipulation capabilities.
  • Networking Equipment: Employs in routers and switches to enhance buffer memory capabilities, ensuring efficient data flow and network stability.
  • Telecommunications Infrastructure: Acts as transient data storage in telecom hardware to facilitate rapid signal processing and data handling.
  • Aerospace and Defense Systems: Integrated into aerospace and defense electronics to provide reliable and quick access to critical data under harsh conditions.
  • Automotive Electronics: Used in automotive control units where fast data retrieval and storage are necessary for real-time system responsiveness.
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