IS61LF102418A-7.5B3
- Mfr.Part #
- IS61LF102418A-7.5B3
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 11,356
- In Stock :
- 11,356
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Number of Functions :
- 1
- RoHS Status :
- ROHS3 Compliant
- Package / Case :
- 165-TBGA
- HTS Code :
- 8542.32.00.41
- Surface Mount :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Qualification Status :
- Not Qualified
- Clock Frequency :
- 117MHz
- Memory Interface :
- Parallel
- Standby Current-Max :
- 0.075A
- Output Characteristics :
- 3-STATE
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Memory Density :
- 18874368 bit
- Width :
- 13mm
- Packaging :
- Tray
- Height Seated (Max) :
- 1.2mm
- Memory Size :
- 18Mb 1M x 18
- Voltage - Supply :
- 3.135V~3.465V
- Mounting Type :
- Surface Mount
- Memory Format :
- SRAM
- Standby Voltage-Min :
- 3.14V
- I/O Type :
- COMMON
- Number of Pins :
- 165
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- ECCN Code :
- 3A991.B.2.A
- JESD-609 Code :
- e0
- Supply Voltage-Min (Vsup) :
- 3.135V
- Memory Width :
- 18
- Pbfree Code :
- No
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Access Time :
- 7.5ns
- Power Supplies :
- 2.5/3.33.3V
- Supply Current-Max :
- 0.25mA
- Organization :
- 1MX18
- Additional Feature :
- PIPELINED ARCHITECTURE, FLOW-THROUGH
- Length :
- 15mm
- Supply Voltage :
- 3.3V
- Supply Voltage-Max (Vsup) :
- 3.465V
- Number of Terminations :
- 165
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Memory Type :
- Volatile
- Pin Count :
- 165
- Operating Temperature :
- -40°C~85°C TA
- Datasheets
- IS61LF102418A-7.5B3
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61LF102418A-7.5B3 Overview
The IS61LF102418A-7.5B3 by Integrated Silicon Solution, Inc. (ISSI) is a cutting-edge SRAM (Static Random Access Memory) component designed for high-speed and high-capacity memory requirements. With an impressive 18Mbit capacity and a compact 165TFBGA (Thin Fine Pitch Ball Grid Array) package, this SRAM module is engineered to deliver reliable, rapid data access and storage. It stands out in the Memory category for its advanced technology and robust performance, making it a prime choice for businesses looking to enhance their electronic systems. The integration of such a Memory component ensures efficiency and durability in demanding applications, fostering advancements in electronic design and functionality.
IS61LF102418A-7.5B3 Features
This SRAM device boasts a parallel interface, allowing for quick data transfer rates and seamless integration into existing architectures. Its 7.5 ns access time is tailored for applications requiring high-speed memory access, enhancing overall system responsiveness. The 165TFBGA package not only minimizes the footprint on circuit boards but also aids in better thermal management, thus improving the reliability and longevity of the device under varying operational conditions.
IS61LF102418A-7.5B3 Applications
- Telecommunications Equipment: Utilized in routers and switches, the IS61LF102418A-7.5B3 provides the necessary speed and capacity for handling high volumes of data traffic efficiently.
- Automotive Electronics: Supports advanced automotive systems such as infotainment units and driver assistance systems, where quick data retrieval is crucial.
- Industrial Automation: Ideal for use in PLCs (Programmable Logic Controllers) and other automation technologies, enhancing process control and machine-to-machine communication.
- Medical Devices: Employs in critical medical imaging equipment, ensuring rapid access to data, crucial for real-time monitoring and diagnostics.
- Consumer Electronics: Applied in high-performance gaming consoles and smart home devices, where enhanced memory capacity and speed improve user experience and functionality.
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