IS61LF102418A-6.5B3I
- Mfr.Part #
- IS61LF102418A-6.5B3I
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 10,598
- In Stock :
- 10,598
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Number of Terminations :
- 165
- Memory Width :
- 18
- Operating Temperature :
- -40°C~85°C TA
- Address Bus Width :
- 20b
- Organization :
- 1MX18
- JESD-609 Code :
- e0
- RoHS Status :
- ROHS3 Compliant
- Standby Voltage-Min :
- 3.14V
- Number of Functions :
- 1
- Supply Voltage :
- 3.3V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Surface Mount :
- yes
- Additional Feature :
- PIPELINED ARCHITECTURE, FLOW-THROUGH
- Length :
- 15mm
- Clock Frequency :
- 133MHz
- Number of Pins :
- 165
- Access Time :
- 6.5ns
- Package / Case :
- 165-TBGA
- Word Size :
- 18b
- Pin Count :
- 165
- Memory Type :
- Volatile
- Voltage - Supply :
- 3.135V~3.465V
- Sync/Async :
- SYNCHRONOUS
- Memory Interface :
- Parallel
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Nominal Supply Current :
- 275mA
- Operating Supply Voltage :
- 3.3V
- Output Characteristics :
- 3-STATE
- Standby Current-Max :
- 0.075A
- Terminal Pitch :
- 1mm
- Mounting Type :
- Surface Mount
- Supply Voltage-Max (Vsup) :
- 3.465V
- Terminal Position :
- BOTTOM
- Pbfree Code :
- No
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Density :
- 18 Mb
- Number of Ports :
- 2
- Packaging :
- Tray
- Supply Voltage-Min (Vsup) :
- 3.135V
- I/O Type :
- COMMON
- Qualification Status :
- Not Qualified
- Memory Format :
- SRAM
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Memory Size :
- 18Mb 1M x 18
- Datasheets
- IS61LF102418A-6.5B3I
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61LF102418A-6.5B3I Overview
The Memory Integrated Silicon Solution, Inc. (ISSI) IS61LF102418A-6.5B3I is a high-performance 18Mbit SRAM module, engineered to meet the demanding requirements of advanced computing and high-speed data processing systems. This IC SRAM component, housed in a compact 165TFBGA package, offers a robust parallel interface ensuring fast data access times of 6.5ns, which makes it exceptionally suitable for applications requiring high bandwidth and low latency. Its reliability and durability are enhanced by the industrial temperature range it operates within, making it an ideal choice for sophisticated electronics that must perform under varying environmental conditions.
IS61LF102418A-6.5B3I Features
The IS61LF102418A-6.5B3I SRAM by ISSI features an impressive 18Mbit capacity with a quick access time of 6.5ns. It supports a parallel interface for straightforward integration into existing architectures. The 165TFBGA package not only minimizes space on the PCB but also enhances the thermal management characteristics of the device, supporting sustained performance across diverse operating conditions. Furthermore, it is designed for low power consumption, aiding in more efficient energy use in complex electronic systems.
IS61LF102418A-6.5B3I Applications
- High-Performance Computing: Utilized in servers and workstations where quick data buffering and high-speed cache are critical for efficient processing.
- Networking Equipment: Acts as a buffer memory in routers and switches, improving bandwidth and reducing latency for high-speed data transmission.
- Telecommunications: Employed in telecom infrastructure to ensure rapid access to data, essential for real-time communication applications.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to process large amounts of data from vehicle sensors quickly.
- Industrial Automation: Integrates into control systems that require fast and reliable data handling to optimize automation processes.
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