IS61DDB22M18C-250M3
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- Mfr.Part #
- IS61DDB22M18C-250M3
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 165LFBGA
- Stock
- 31,933
- In Stock ：
- 31,933
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Memory Width :
- 18
- Memory Interface :
- Parallel
- Packaging :
- Tray
- Access Time :
- 8.4ns
- Supply Voltage-Min (Vsup) :
- 1.71V
- Terminal Position :
- BOTTOM
- Memory Format :
- SRAM
- Memory Type :
- Volatile
- Operating Temperature :
- 0°C~70°C TA
- Package / Case :
- 165-LBGA
- Voltage - Supply :
- 1.71V~1.89V
- Length :
- 17mm
- JESD-30 Code :
- R-PBGA-B165
- Number of Terminations :
- 165
- Organization :
- 2MX18
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Density :
- 37748736 bit
- RoHS Status :
- Non-RoHS Compliant
- Surface Mount :
- yes
- Width :
- 15mm
- Number of Functions :
- 1
- Mounting Type :
- Surface Mount
- Memory Size :
- 36Mb 2M x 18
- Supply Voltage-Max (Vsup) :
- 1.89V
- Terminal Pitch :
- 1mm
- Clock Frequency :
- 250MHz
- Supply Voltage :
- 1.8V
- HTS Code :
- 8542.32.00.41
- Height Seated (Max) :
- 1.4mm
- Datasheets
- IS61DDB22M18C-250M3
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61DDB22M18C-250M3 Overview
The Memory Integrated Silicon Solution, Inc. (ISSI) IS61DDB22M18C-250M3 is a high-performance 36Mbit SRAM chip, engineered for rapid data access and optimized for high-speed industrial and commercial applications. Encased in a compact 165LFBGA package, this SRAM device offers a stable and reliable parallel interface, ensuring seamless integration into advanced digital systems. Its robust design is tailored to meet the stringent demands of extensive data processing and storage, providing a solid foundation for systems requiring quick memory retrieval and exceptional data integrity.
IS61DDB22M18C-250M3 Features
This SRAM chip boasts several distinctive features including a large 36Mbit capacity and a parallel interface, which allows for quick data transfer rates. The 165LFBGA packaging not only minimizes space on printed circuit boards but also enhances thermal stability and reduces electromagnetic interference, making it an excellent choice for densely packed electronics. Additionally, its operation at 250 MHz provides high-speed access to data, crucial for performance-critical applications.
IS61DDB22M18C-250M3 Applications
- Advanced Computing Systems: Utilized in server farms and data centers due to its high bandwidth and capacity, facilitating rapid access and processing of large data volumes.
- Networking Equipment: Integral in switches and routers, where speed and data integrity are paramount for managing high-speed network communications.
- Telecommunications: Deployed in telecommunications infrastructure to ensure quick data retrieval and buffering in communication devices and signal processing.
- Aerospace and Defense: Used in applications requiring high reliability and data integrity under extreme conditions, such as satellite communications and avionic systems.
- Automotive Electronics: Supports advanced driver-assistance systems (ADAS) and other in-vehicle networks that require fast data access and real-time processing.
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Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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