IS61DDB22M18-250M3
- Mfr.Part #
- IS61DDB22M18-250M3
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 165LFBGA
- Stock
- 26,827
- In Stock :
- 26,827
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Memory Size :
- 36Mb 2M x 18
- Mounting Type :
- Surface Mount
- Number of Terminations :
- 165
- Radiation Hardening :
- No
- Address Bus Width :
- 21b
- Memory Interface :
- Parallel
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Surface Mount :
- yes
- Number of Ports :
- 1
- Supply Voltage :
- 1.8V
- Memory Width :
- 18
- Number of Functions :
- 1
- Number of Pins :
- 165
- Pbfree Code :
- No
- RoHS Status :
- Non-RoHS Compliant
- Operating Temperature :
- 0°C~70°C TA
- Operating Supply Voltage :
- 1.8V
- I/O Type :
- COMMON
- Pin Count :
- 165
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 2 (1 Year)
- JESD-609 Code :
- e0
- Output Characteristics :
- 3-STATE
- Access Time :
- 4 ns
- Package / Case :
- 165-LBGA
- Density :
- 36 Mb
- Standby Current-Max :
- 0.2A
- Additional Feature :
- PIPELINED ARCHITECTURE
- Memory Format :
- SRAM
- Packaging :
- Tray
- Clock Frequency :
- 250MHz
- Voltage - Supply :
- 1.71V~1.89V
- Supply Current-Max :
- 0.55mA
- Memory Type :
- Volatile
- Datasheets
- IS61DDB22M18-250M3
Memory Integrated Silicon Solution, Inc. (ISSI) IS61DDB22M18-250M3 Overview
Unleashing robust performance and high-end reliability, the Memory Integrated Silicon Solution, Inc. (ISSI) IS61DDB22M18-250M3 stands out as a paramount choice for specialized high-speed applications. This IC SRAM chip features a generous 36Mbit capacity, designed meticulously for operations demanding expansive memory and rapid access. Housed in a compact 165LFBGA package, it ensures optimal density for sophisticated electronic assemblies, making it ideal for designers focusing on efficiency and performance in their systems. This product not only meets the demanding specifications required by advanced electronic systems but does so with the reliability expected from a leading manufacturer like ISSI.
IS61DDB22M18-250M3 Features
The IS61DDB22M18-250M3 integrates essential features that make it a premium choice in its category. The device operates at a speed of 250 MHz, facilitating high-speed data processing capabilities essential for modern technology demands. It offers a parallel interface, which simplifies integration into existing architectures, providing flexibility and ease of design. The compact 165LFBGA packaging not only minimizes space requirements but also enhances thermal management, crucial for maintaining integrity and performance under varied operational conditions.
IS61DDB22M18-250M3 Applications
- Networking Equipment: Utilized in routers and switches for buffer memory, enhancing data flow management and speed.
- Telecommunications: Key component in telecom infrastructure, aiding in high-speed signal processing to maintain seamless communication channels.
- High-Performance Computing: Serves as cache memory in servers and high-end workstations, facilitating faster access to frequently used data, thus improving overall system efficiency.
- Automotive Electronics: Employed in advanced driver-assistance systems (ADAS) to process large amounts of data from vehicle sensors in real time.
- Video Streaming Devices: Improves data buffering for high-resolution video processing, ensuring smooth streaming experiences.
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