IS61DDB22M18-250M3

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Mfr.Part #
IS61DDB22M18-250M3
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165LFBGA
Stock
26,827
In Stock :
26,827

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Memory Size :
36Mb 2M x 18
Mounting Type :
Surface Mount
Number of Terminations :
165
Radiation Hardening :
No
Address Bus Width :
21b
Memory Interface :
Parallel
Terminal Finish :
Tin/Lead (Sn/Pb)
Surface Mount :
yes
Number of Ports :
1
Supply Voltage :
1.8V
Memory Width :
18
Number of Functions :
1
Number of Pins :
165
Pbfree Code :
No
RoHS Status :
Non-RoHS Compliant
Operating Temperature :
0°C~70°C TA
Operating Supply Voltage :
1.8V
I/O Type :
COMMON
Pin Count :
165
Terminal Position :
BOTTOM
Moisture Sensitivity Level (MSL) :
2 (1 Year)
JESD-609 Code :
e0
Output Characteristics :
3-STATE
Access Time :
4 ns
Package / Case :
165-LBGA
Density :
36 Mb
Standby Current-Max :
0.2A
Additional Feature :
PIPELINED ARCHITECTURE
Memory Format :
SRAM
Packaging :
Tray
Clock Frequency :
250MHz
Voltage - Supply :
1.71V~1.89V
Supply Current-Max :
0.55mA
Memory Type :
Volatile
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61DDB22M18-250M3 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:165, Number of Pins:165, Operating Temperature:0°C~70°C TA, Package / Case:165-LBGA, IS61DDB22M18-250M3 pinout, IS61DDB22M18-250M3 datasheet PDF, IS61DDB22M18-250M3 amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61DDB22M18-250M3 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61DDB22M18-250M3


Memory Integrated Silicon Solution, Inc. (ISSI) IS61DDB22M18-250M3 Overview

Unleashing robust performance and high-end reliability, the Memory Integrated Silicon Solution, Inc. (ISSI) IS61DDB22M18-250M3 stands out as a paramount choice for specialized high-speed applications. This IC SRAM chip features a generous 36Mbit capacity, designed meticulously for operations demanding expansive memory and rapid access. Housed in a compact 165LFBGA package, it ensures optimal density for sophisticated electronic assemblies, making it ideal for designers focusing on efficiency and performance in their systems. This product not only meets the demanding specifications required by advanced electronic systems but does so with the reliability expected from a leading manufacturer like ISSI.

IS61DDB22M18-250M3 Features

The IS61DDB22M18-250M3 integrates essential features that make it a premium choice in its category. The device operates at a speed of 250 MHz, facilitating high-speed data processing capabilities essential for modern technology demands. It offers a parallel interface, which simplifies integration into existing architectures, providing flexibility and ease of design. The compact 165LFBGA packaging not only minimizes space requirements but also enhances thermal management, crucial for maintaining integrity and performance under varied operational conditions.

IS61DDB22M18-250M3 Applications

  • Networking Equipment: Utilized in routers and switches for buffer memory, enhancing data flow management and speed.
  • Telecommunications: Key component in telecom infrastructure, aiding in high-speed signal processing to maintain seamless communication channels.
  • High-Performance Computing: Serves as cache memory in servers and high-end workstations, facilitating faster access to frequently used data, thus improving overall system efficiency.
  • Automotive Electronics: Employed in advanced driver-assistance systems (ADAS) to process large amounts of data from vehicle sensors in real time.
  • Video Streaming Devices: Improves data buffering for high-resolution video processing, ensuring smooth streaming experiences.
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