IS61DDB21M36C-300M3
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- Mfr.Part #
- IS61DDB21M36C-300M3
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 165LFBGA
- Stock
- 7,411
- In Stock ：
- 7,411
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Memory Type :
- Volatile
- Memory Interface :
- Parallel
- Memory Format :
- SRAM
- Clock Frequency :
- 300MHz
- Width :
- 15mm
- Surface Mount :
- yes
- Terminal Pitch :
- 1mm
- Organization :
- 1MX36
- Height Seated (Max) :
- 1.4mm
- Number of Terminations :
- 165
- Memory Size :
- 36Mb 1M x 36
- Memory Width :
- 36
- Access Time :
- 8.4ns
- Packaging :
- Tray
- Supply Voltage-Max (Vsup) :
- 1.89V
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 1.8V
- Supply Voltage-Min (Vsup) :
- 1.71V
- RoHS Status :
- Non-RoHS Compliant
- Operating Temperature :
- 0°C~70°C TA
- HTS Code :
- 8542.32.00.41
- Mounting Type :
- Surface Mount
- Length :
- 17mm
- Number of Functions :
- 1
- Package / Case :
- 165-LBGA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- JESD-30 Code :
- R-PBGA-B165
- Memory Density :
- 37748736 bit
- Voltage - Supply :
- 1.71V~1.89V
- Datasheets
- IS61DDB21M36C-300M3
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Memory Integrated Silicon Solution, Inc. IS61DDB21M36C-300M3 Overview
The Memory Integrated Silicon Solution, Inc. IS61DDB21M36C-300M3 is a high-performance 36Mbit SRAM IC, expertly crafted by Integrated Silicon Solution, Inc. (ISSI). This device is engineered to provide robust, high-speed data storage and retrieval solutions with its parallel interface. Encased in a compact 165LFBGA package, it offers enhanced durability and optimal thermal management, making it ideal for advanced industrial, computing, and telecommunications systems. The IS61DDB21M36C-300M3 SRAM is designed to meet the rigorous demands of applications requiring high memory bandwidth and low latency, facilitating efficient system performance and reliability.
IS61DDB21M36C-300M3 Features
This 36Mbit SRAM features a parallel interface, providing quick and efficient data handling capabilities essential for high-performance computing environments. Its 165LFBGA packaging not only ensures a minimized footprint on system boards but also offers superior heat dissipation characteristics, crucial for maintaining system stability under high load conditions. With its ability to operate at a speed of 300 MHz, the IS61DDB21M36C-300M3 facilitates rapid access and processing of large datasets, which is pivotal for real-time applications.
IS61DDB21M36C-300M3 Applications
- Advanced Computing Systems: Utilizes high-speed data transfer capabilities to handle complex computations and multiple processes simultaneously, enhancing overall system efficiency.
- Telecommunication Infrastructure: Supports the demands of high-speed data transmission and storage, ensuring reliable and continuous network service availability.
- Industrial Automation: Provides the memory required for control systems to execute real-time decisions and actions, crucial for automated manufacturing processes.
- Automotive Technology: Used in advanced driver-assistance systems (ADAS) to rapidly process information from vehicle sensors, contributing to safer driving conditions.
- Aerospace and Defense: Suitable for applications demanding high reliability and endurance in harsh environments, such as satellite communications and onboard systems in aircraft.
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Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
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