IPT1-110-01-L-D-VS-PL
- Mfr.Part #
- IPT1-110-01-L-D-VS-PL
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 20POS 2.54MM
- Stock
- 12,401
- In Stock :
- 12,401
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Mounting Type :
- Surface Mount
- Series :
- Mini Mate® IPT1
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Insulation Color :
- Black
- Fastening Type :
- Push-Pull
- Number of Positions Loaded :
- 19
- Operating Temperature :
- -55°C~125°C
- Contact Shape :
- Square
- Contact Finish - Mating :
- Gold
- Current Rating (Amps) :
- 2.3A per Contact
- Voltage - Rated :
- 775VAC 1095VDC
- Material Flammability Rating :
- UL94 V-0
- Contact Type :
- Male Pin
- Contact Material :
- Phosphor Bronze
- Packaging :
- Bulk
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Factory Lead Time :
- 3 Weeks
- Termination :
- Solder
- Shrouding :
- Shrouded - 4 Wall
- Insulation Height :
- 0.250 6.35mm
- Style :
- Board to Board
- RoHS Status :
- ROHS3 Compliant
- Contact Finish - Post :
- Tin
- Contact Length - Mating :
- 0.155 3.94mm
- Connector Type :
- Header
- Pitch - Mating :
- 0.100 2.54mm
- Number of Positions :
- 20
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Number of Rows :
- 2
- Datasheets
- IPT1-110-01-L-D-VS-PL
Mini Mate® IPT1 Series 2-Row Header Solder Phosphor Bronze Bulk Surface Mount Gold Liquid Crystal Polymer (LCP) 20-Position Board to Board 0.250 6.35mm Height
IPT1-110-01-L-D-VS-PL Overview
Packaging for this item is Header.There is a mounting type of Surface Mount for this device.It is necessary to use a Bulk case for packaging the product.This product is part of the Mini Mate® IPT1 Series.In this case, the device operates at -55°C~125°C Operating Temperature.
IPT1-110-01-L-D-VS-PL Features
Mini Mate® IPT1 series
IPT1-110-01-L-D-VS-PL Applications
There are a lot of Samtec Inc.
IPT1-110-01-L-D-VS-PL Rectangular Connectors applications.
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
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