IDT71V67602S166BQG8

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Mfr.Part #
IDT71V67602S166BQG8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 165CABGA
Stock
41,095
In Stock :
41,095

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Voltage - Supply :
3.135V~3.465V
Memory Format :
SRAM
Packaging :
Tape and Reel (TR)
Base Part Number :
IDT71V67602
Package / Case :
165-TBGA
Memory Size :
9Mb 256K x 36
Mounting Type :
Surface Mount
Access Time :
3.5ns
Supplier Device Package :
165-CABGA (13x15)
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Type :
Volatile
Operating Temperature :
0°C~70°C TA
Clock Frequency :
166MHz
Introducing Memory Intersil (Renesas Electronics Corporation) IDT71V67602S166BQG8 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:IDT71V67602, Package / Case:165-TBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, IDT71V67602S166BQG8 pinout, IDT71V67602S166BQG8 datasheet PDF, IDT71V67602S166BQG8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT71V67602S166BQG8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT71V67602S166BQG8


Memory Intersil (Renesas Electronics Corporation) IDT71V67602S166BQG8 Overview

The Memory Intersil (Renesas Electronics Corporation) IDT71V67602S166BQG8 is a high-performance 9Mbit SRAM chip, featuring a parallel interface encapsulated in a compact 165CABGA package. This advanced memory solution is designed for high-speed applications requiring quick data access and high bandwidth. The robust design and manufacturing expertise of Intersil (Renesas Electronics Corporation) ensure reliability and durability, making this memory module ideal for sophisticated digital systems that demand consistent performance under varying conditions.

IDT71V67602S166BQG8 Features

This SRAM module offers a large 9MB memory capacity with a parallel interface, ensuring rapid data access and processing speeds. Housed in a 165-ball CABGA (Chip Array Ball Grid Array) package, it provides a stable, secure mounting solution and efficient heat dissipation, crucial for maintaining integrity and performance. The parallel architecture of this chip facilitates easier integration into existing technology platforms, enhancing system responsiveness and throughput.

IDT71V67602S166BQG8 Applications

  • Networking Equipment: Utilized in routers, switches, and other networking hardware to manage buffer data flows effectively, enhancing device throughput and reliability in communication environments.
  • Telecommunication Infrastructure: Plays a crucial role in telecommunications systems for fast data caching, which helps in managing signal processing tasks smoothly and efficiently.
  • High-Performance Computing: Supports high-speed computing tasks in supercomputers and data centers requiring rapid access to large data sets to facilitate complex computations and data analysis.
  • Industrial Applications: Ideal for use in industrial control systems where robust data retention and quick access are necessary for real-time processing and control operations.
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