IDT71V432S6PF

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Mfr.Part #
IDT71V432S6PF
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
LQFP
Datasheet
Download
Description
IC SRAM 1MBIT PARALLEL 100TQFP
Stock
9,146
In Stock :
9,146

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Terminal Position :
QUAD
HTS Code :
8542.32.00.41
Power Supplies :
3.3V
JESD-609 Code :
e0
Operating Temperature :
0°C ~ 70°C (TA)
Terminal Form :
Gull wing
Output Characteristics :
3-STATE
Series :
--
Height Seated (Max) :
1.6mm
Packaging :
Tray
Time@Peak Reflow Temperature-Max (s) :
20
Memory Type :
RAM, SRAM
Min Operating Temperature :
0°C
Number of Terminations :
100
Access Time :
6ns
Memory Width :
32
Length :
20mm
Number of Ports :
1
ECCN Code :
3A991.B.2.B
Mounting Type :
Surface Mount
Width :
14mm
Standby Voltage-Min :
3.14V
Voltage - Supply :
3.135 V ~ 3.63 V
Organization :
32KX32
Memory Format :
SRAM
Max Operating Temperature :
70°C
Reach Compliance Code :
not_compliant
Pin Count :
100
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage-Max (Vsup) :
3.63V
Standby Current-Max :
0.015A
Supplier Device Package :
100-TQFP (14x14)
Terminal Finish :
Tin/Lead (Sn85Pb15)
Write Cycle Time - Word, Page :
--
Terminal Pitch :
0.65mm
RoHS Status :
Non-RoHS Compliant
Clock Frequency :
83MHz
Supply Current-Max :
0.18mA
Peak Reflow Temperature (Cel) :
240
I/O Type :
COMMON
Memory Density :
1048576 bit
Supply Voltage-Min (Vsup) :
3.135V
Memory Size :
1Mb (32K x 32)
Temperature Grade :
COMMERCIAL
Memory Interface :
Parallel
Interface :
Parallel
Access Time (Max) :
6 ns
Package / Case :
LQFP
Qualification Status :
Not Qualified
JESD-30 Code :
R-PQFP-G100
Published :
2014
Number of Functions :
1
Operating Mode :
SYNCHRONOUS
Surface Mount :
yes
Output Enable :
yes
Base Part Number :
IDT71V432
Supply Voltage :
3.3V
Datasheets
IDT71V432S6PF
Introducing Memory Intersil (Renesas Electronics Corporation) IDT71V432S6PF from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C ~ 70°C (TA), Number of Terminations:100, Mounting Type:Surface Mount, Package / Case:LQFP, Base Part Number:IDT71V432, IDT71V432S6PF pinout, IDT71V432S6PF datasheet PDF, IDT71V432S6PF amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT71V432S6PF ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT71V432S6PF


Memory Intersil (Renesas Electronics Corporation) IDT71V432S6PF Overview

The Memory Intersil (Renesas Electronics Corporation) IDT71V432S6PF is an advanced high-speed static RAM (SRAM) designed for fast and reliable performance. This integrated circuit features a 1Mbit parallel interface, enclosed in a compact 100TQFP package, making it ideal for applications requiring high-speed data access and storage. The SRAM module is tailored for systems that demand low latency and high throughput, providing a robust solution for sophisticated digital systems. Its incorporation of advanced silicon technology from Intersil ensures reliability and performance, which is essential for B2B clients looking to incorporate high-quality components in their bulk product designs.

IDT71V432S6PF Features

The IDT71V432S6PF boasts several key features that enhance its usability and functionality in complex electronic systems. Key features include a large 1Mbit storage capacity, high-speed data retention using parallel access modes, and low-power consumption that extends the life of mobile and embedded applications. The chip's compatibility with a 100-pin TQFP packaging ensures easy integration into existing designs without the need for significant board redesigns.

IDT71V432S6PF Applications

  • Networking Equipment: Utilized in routers and switches for buffering and data queuing due to its high-speed access and reliability.
  • Industrial Control Systems: Serves as data storage for real-time process control where quick access to data is crucial.
  • Telecommunications: Used in telecommunications infrastructure to handle rapid signal processing and data flow management.
  • Automotive Electronics: Integral in advanced driver-assistance systems (ADAS) for real-time sensor data processing.
  • Medical Devices: Key component in medical imaging systems, storing high-resolution images and patient data securely and efficiently.
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