IDT71V3577SA75BQGI

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Mfr.Part #
IDT71V3577SA75BQGI
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 4.5MBIT PAR 165CABGA
Stock
18,807
In Stock :
18,807

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Packaging :
Tray
Operating Temperature :
-40°C~85°C TA
Memory Size :
4.5Mb 128K x 36
Memory Interface :
Parallel
Access Time :
7.5ns
Memory Type :
Volatile
Base Part Number :
IDT71V3577
Voltage - Supply :
3.135V~3.465V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Package / Case :
165-TBGA
Memory Format :
SRAM
Introducing Memory Intersil (Renesas Electronics Corporation) IDT71V3577SA75BQGI from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Base Part Number:IDT71V3577, Mounting Type:Surface Mount, Package / Case:165-TBGA, IDT71V3577SA75BQGI pinout, IDT71V3577SA75BQGI datasheet PDF, IDT71V3577SA75BQGI amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT71V3577SA75BQGI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT71V3577SA75BQGI


Memory Intersil (Renesas Electronics Corporation) IDT71V3577SA75BQGI Overview

The Memory Intersil (Renesas Electronics Corporation) IDT71V3577SA75BQGI is a high-performance, 4.5Mbit SRAM chip designed for fast and reliable data storage and retrieval in advanced computing systems. This IC features a parallel interface and is housed in a 165-pin CABGA package, offering robust environmental resistance and long-term reliability. With its high-speed data access and large memory capacity, the IDT71V3577SA75BQGI is ideal for applications requiring rapid data buffering and storage solutions, catering to the needs of sophisticated electronic systems in a variety of markets.

IDT71V3577SA75BQGI Features

This SRAM device provides several key features including a high data bandwidth and low latency access time, making it suitable for high-performance applications. It operates over a wide temperature range, ensuring performance stability under extreme conditions. The 165CABGA package is designed for optimal space utilization and enhanced thermal management, which is crucial for maintaining integrity and functionality of the memory module in dense electronic assemblies.

IDT71V3577SA75BQGI Applications

  • Networking Equipment: Utilized in routers, switches, and other networking devices where fast access to large amounts of data is crucial for efficient data packet processing and routing.
  • Telecommunications: Integrated in telecommunications infrastructure to provide buffering for high-speed data transfers and real-time communication services.
  • Industrial Automation: Employed in automated control systems for rapid task processing and data logging, enhancing operational efficiencies and system reliability.
  • High-performance Computing: Serves as temporary data storage in servers and supercomputers, facilitating quick data access and processing for complex computations and large-scale data analysis.
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