IDT71V35761SA166BQI8

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Mfr.Part #
IDT71V35761SA166BQI8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 4.5MBIT PAR 165CABGA
Stock
47,958
In Stock :
47,958

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Base Part Number :
IDT71V35761
Memory Interface :
Parallel
Package / Case :
165-TBGA
Memory Type :
Volatile
Voltage - Supply :
3.135V~3.465V
Memory Format :
SRAM
Access Time :
3.5ns
Clock Frequency :
166MHz
RoHS Status :
Non-RoHS Compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Operating Temperature :
-40°C~85°C TA
Memory Size :
4.5Mb 128K x 36
Packaging :
Tape and Reel (TR)
Introducing Memory Intersil (Renesas Electronics Corporation) IDT71V35761SA166BQI8 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:IDT71V35761, Package / Case:165-TBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, IDT71V35761SA166BQI8 pinout, IDT71V35761SA166BQI8 datasheet PDF, IDT71V35761SA166BQI8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT71V35761SA166BQI8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT71V35761SA166BQI8


Memory Intersil (Renesas Electronics Corporation) IDT71V35761SA166BQI8 Overview

The Memory Intersil (Renesas Electronics Corporation) IDT71V35761SA166BQI8 SRAM chip offers high-speed data storage and retrieval with its 4.5Mbit capacity and parallel interface, encapsulated in a compact 165CABGA package. Designed to meet the rigorous demands of advanced computing and high-speed processing environments, this IC is built for reliability and performance. Its dense configuration and energy efficiency make it an ideal choice for sophisticated electronic systems requiring rapid access to large volumes of data.

IDT71V35761SA166BQI8 Features

This high-performance SRAM features a fast access time, making it suitable for applications that demand quick data retrieval. The chip's 165-ball CABGA packaging ensures a minimal footprint on the circuit board while providing robust connectivity, essential for high-density electronic assemblies. Furthermore, its compatibility with a wide range of operating temperatures (-40°C to +85°C) certifies its reliability in a variety of challenging environments.

IDT71V35761SA166BQI8 Applications

  • Networking Equipment: Utilized in routers and switches for packet buffering, ensuring efficient data flow and speed across the network.
  • Telecommunications: Deployed in telecom infrastructure to manage data transactions and signal processing, enhancing communication reliability and quality.
  • Industrial Automation: Applied in automated control systems for real-time processing and data logging, optimizing operational efficiency and precision.
  • High-Performance Computing: Integrated into servers and supercomputers for fast data caching, supporting intensive computational tasks and large-scale data analysis.
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