IDT71V35761S183BQ8

Memory Intersil (Renesas Electronics Corporation) IDT71V35761S183BQ8 Overview

The Memory Intersil (Renesas Electronics Corporation) IDT71V35761S183BQ8 is a high-performance integrated circuit designed for demanding storage applications. This 4.5Mbit SRAM device, housed in a compact 165CABGA package, offers robust parallel interface capabilities, making it an ideal solution for applications requiring fast access and high reliability. The high-density configuration and advanced fabrication technology of this SRAM enable efficient management and processing of large volumes of data, catering to the needs of advanced industrial, computing, and telecommunication systems. Its reliability and speed make it particularly suitable for B2B customers looking to integrate high-quality memory solutions into their products.

IDT71V35761S183BQ8 Features

This SRAM unit provides several key features that enhance its performance in a variety of settings. These include a large 4.5Mbit storage capacity and a fast access time, all encapsulated within a high-density 165-ball CABGA package. Its parallel interface ensures quick data transfer rates, which is critical for applications that demand rapid processing and retrieval of information. The design and manufacturing by Renesas Electronics Corporation, a leader in semiconductor solutions, ensure high reliability and durability under rigorous operational conditions.

IDT71V35761S183BQ8 Applications

• Advanced Networking Equipment: Utilized in routers and switches, this SRAM helps manage data flow efficiently, enhancing network reliability and performance.
• High-Performance Computing: Supports critical applications in supercomputing environments where speed and data integrity are paramount.
• Telecommunications Infrastructure: Applied in telecommunications systems for fast processing and storage of information, ensuring smooth and efficient network operations.
• Industrial Automation: Facilitates improved response times and reliability in automated control systems for manufacturing processes.
• Aerospace and Defense: Used in systems requiring high levels of data integrity and security under extreme conditions.