IDT71V3557SA85BQG8

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Mfr.Part #
IDT71V3557SA85BQG8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 4.5MBIT PAR 165CABGA
Stock
48,504
In Stock :
48,504

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Interface :
Parallel
Memory Type :
Volatile
Access Time :
8.5ns
Operating Temperature :
0°C~70°C TA
Voltage - Supply :
3.135V~3.465V
Base Part Number :
IDT71V3557
Memory Format :
SRAM
Packaging :
Tape and Reel (TR)
Memory Size :
4.5Mb 128K x 36
Mounting Type :
Surface Mount
Package / Case :
165-TBGA
Supplier Device Package :
165-CABGA (13x15)
Introducing Memory Intersil (Renesas Electronics Corporation) IDT71V3557SA85BQG8 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Base Part Number:IDT71V3557, Mounting Type:Surface Mount, Package / Case:165-TBGA, IDT71V3557SA85BQG8 pinout, IDT71V3557SA85BQG8 datasheet PDF, IDT71V3557SA85BQG8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT71V3557SA85BQG8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT71V3557SA85BQG8


Memory Intersil (Renesas Electronics Corporation) IDT71V3557SA85BQG8 Overview

The Memory Intersil (Renesas Electronics Corporation) IDT71V3557SA85BQG8 is an advanced SRAM device designed for high-speed, high-capacity storage solutions. With a total of 4.5Mbit of storage, this IC excels in scenarios demanding rapid access to large volumes of data. The IC's robust 165CABGA package ensures reliable integration into various industrial and commercial applications. Built to address the escalating demands for efficient data management within complex systems, this memory module combines performance with stability, making it an ideal choice for critical applications in demanding environments.

IDT71V3557SA85BQG8 Features

This integrated circuit boasts a parallel interface, facilitating swift data transfer rates that are essential for applications where speed is critical. The 165CABGA packaging not only provides a compact footprint but also offers enhanced thermal management, critical for maintaining integrity and performance under high operational loads. Furthermore, the IC's design is optimized for low power consumption, which extends the lifespan of devices and reduces operational costs.

IDT71V3557SA85BQG8 Applications

  • Networking Equipment: Utilized in routers and switches, where high-speed data buffering is crucial for managing network traffic efficiently.
  • Telecommunications: Key component in telecommunications infrastructure, supporting fast data access to improve bandwidth and reduce latency.
  • Industrial Automation: Enhances performance and reliability of automated systems by providing rapid access to data critical for real-time processing.
  • Medical Imaging Systems: Supports complex medical imaging technologies by facilitating quick retrieval and manipulation of large image files.
  • High-performance Computing: Integral to supercomputers and data centers requiring fast data throughput and high capacity memory storage.
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