IDT71V25761YSA166BQI8

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Mfr.Part #
IDT71V25761YSA166BQI8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
Datasheet
Download
Description
IC SRAM 4.5MBIT PAR 165CABGA
Stock
1,886
In Stock :
1,886

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Max Operating Temperature :
85°C
Min Operating Temperature :
-40°C
Frequency :
166MHz
Number of Pins :
165
Memory Type :
RAM, SRAM
Packaging :
Tape and Reel (TR)
Interface :
Parallel
Published :
2009
RoHS Status :
Non-RoHS Compliant
Introducing Memory Intersil (Renesas Electronics Corporation) IDT71V25761YSA166BQI8 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:165, IDT71V25761YSA166BQI8 pinout, IDT71V25761YSA166BQI8 datasheet PDF, IDT71V25761YSA166BQI8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT71V25761YSA166BQI8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT71V25761YSA166BQI8


Memory Intersil (Renesas Electronics Corporation) IDT71V25761YSA166BQI8 Overview

Introducing the Memory Intersil (Renesas Electronics Corporation) IDT71V25761YSA166BQI8, a high-performance 4.5Mbit SRAM component that offers exceptional reliability and speed. Designed to meet the rigorous demands of advanced digital systems, this SRAM module uses parallel interface technology to deliver rapid data access times, making it ideal for high-speed computing and real-time processing. The robust 165CABGA package ensures durable integration in various applications, supporting a wide range of industrial temperatures. Its efficient design and stable performance make it a prime choice for developers and manufacturers aiming for top-tier electronic solutions.

IDT71V25761YSA166BQI8 Features

This IC SRAM by Renesas Electronics Corporation features a 4.5Mbit capacity with parallel interface, ensuring high-speed data transmission and low latency in processing. The 165-ball CABGA (Chip Array Ball Grid Array) packaging not only provides compactness but also offers enhanced thermal stability and reliability under extreme conditions. Suitable for operation at industrial temperature ranges, it supports complex computing tasks with ease.

IDT71V25761YSA166BQI8 Applications

  • Networking Equipment: Utilized in routers and switches for buffering and processing large volumes of data efficiently.
  • Telecommunications: Acts as temporary storage for data in telecom infrastructure, facilitating fast access and handling during high data traffic.
  • High-Performance Computing: Supports computing systems requiring rapid access to large datasets, enhancing overall system responsiveness.
  • Automotive Electronics: Ideal for use in advanced driver-assistance systems (ADAS) where quick memory access is crucial.
  • Industrial Automation: Employs in control systems that require fast and reliable data storage to manage and monitor automated processes.
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