IDT71V25761YSA166BG

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Mfr.Part #
IDT71V25761YSA166BG
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
BGA
Datasheet
Download
Description
IC SRAM 4.5MBIT PARALLEL 119PBGA
Stock
16,812
In Stock :
16,812

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Reach Compliance Code :
not_compliant
Output Characteristics :
3-STATE
Terminal Finish :
Tin/Lead (Sn63Pb37)
Surface Mount :
yes
Qualification Status :
Not Qualified
Power Supplies :
2.53.3V
Standby Voltage-Min :
3.14V
Interface :
Parallel
I/O Type :
COMMON
ECCN Code :
3A991.B.2.A
Memory Format :
SRAM
Packaging :
Tray
JESD-609 Code :
e0
Memory Size :
4.5Mb (128K x 36)
Memory Type :
RAM, SRAM
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Clock Frequency :
166MHz
Series :
--
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Frequency :
166MHz
Max Operating Temperature :
70°C
RoHS Status :
Non-RoHS Compliant
Temperature Grade :
COMMERCIAL
Supply Current-Max :
0.32mA
Min Operating Temperature :
0°C
Voltage - Supply :
3.135 V ~ 3.465 V
Access Time (Max) :
3.5 ns
Height Seated (Max) :
2.36mm
Mounting Type :
Surface Mount
Memory Density :
4718592 bit
Number of Terminations :
119
Write Cycle Time - Word, Page :
--
Supplier Device Package :
119-PBGA (14x22)
Length :
22mm
Supply Voltage-Min (Vsup) :
3.135V
Number of Functions :
1
Operating Temperature :
0°C ~ 70°C (TA)
Published :
2009
Additional Feature :
PIPELINED ARCHITECTURE
Memory Interface :
Parallel
Organization :
128KX36
HTS Code :
8542.32.00.41
Supply Voltage :
3.3V
Terminal Form :
Ball
Standby Current-Max :
0.03A
Base Part Number :
IDT71V25761
Terminal Pitch :
1.27mm
Supply Voltage-Max (Vsup) :
3.465V
Operating Mode :
SYNCHRONOUS
Access Time :
3.5ns
Terminal Position :
BOTTOM
Pin Count :
119
Memory Width :
36
Width :
14mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
BGA
Introducing Memory Intersil (Renesas Electronics Corporation) IDT71V25761YSA166BG from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:119, Operating Temperature:0°C ~ 70°C (TA), Base Part Number:IDT71V25761, Package / Case:BGA, IDT71V25761YSA166BG pinout, IDT71V25761YSA166BG datasheet PDF, IDT71V25761YSA166BG amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT71V25761YSA166BG ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT71V25761YSA166BG


Memory Intersil (Renesas Electronics Corporation) IDT71V25761YSA166BG Overview

The Memory Intersil (Renesas Electronics Corporation) IDT71V25761YSA166BG is a high-performance 4.5Mbit SRAM component, designed to deliver robust parallel data processing capabilities in a compact 119-pin PBGA (Plastic Ball Grid Array) package. This IC is tailored for applications demanding high-speed data retention and quick access, ensuring efficient operation and reliability. Its versatility and advanced design make it an ideal choice for integrating into a range of advanced digital systems, providing a solid foundation for developers looking to harness rapid data access and integrity in their designs.

IDT71V25761YSA166BG Features

  • High Density: 4.5Mbit of storage provides ample space for critical data without compromising performance.
  • Parallel Interface: Enables quick and efficient data handling for high-speed computing needs.
  • Compact Form Factor: The 119PBGA packaging allows for dense integration in space-constrained applications, enhancing system design flexibility.

IDT71V25761YSA166BG Applications

  • Networking Equipment: Utilized in routers and switches for fast data caching to improve network efficiency.
  • Telecommunication Infrastructure: Supports high-speed data transmission requirements in telecom network systems.
  • Industrial Automation: Ideal for use in complex automated systems requiring quick access to data for real-time process control.
  • Medical Imaging: Critical in processing large volumes of data quickly in imaging systems such as MRIs and CT scanners for real-time imaging analysis.
  • Aerospace and Defense: Deployed in systems requiring high data integrity and speed, such as in avionics and satellite communication systems.
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