IDT70V7339S166DDI

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Mfr.Part #
IDT70V7339S166DDI
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
144-LQFP Exposed Pad
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 144TQFP
Stock
25,912
In Stock :
25,912

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Package / Case :
144-LQFP Exposed Pad
Voltage - Supply :
3.15V~3.45V
Memory Type :
Volatile
RoHS Status :
Non-RoHS Compliant
Clock Frequency :
166MHz
Memory Interface :
Parallel
Memory Size :
9Mb 512K x 18
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
-40°C~85°C TA
Memory Format :
SRAM
Access Time :
3.6ns
Supplier Device Package :
144-TQFP (20x20)
Base Part Number :
IDT70V7339
Packaging :
Tray
Datasheets
IDT70V7339S166DDI
Introducing Memory Intersil (Renesas Electronics Corporation) IDT70V7339S166DDI from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:144-LQFP Exposed Pad, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Base Part Number:IDT70V7339, IDT70V7339S166DDI pinout, IDT70V7339S166DDI datasheet PDF, IDT70V7339S166DDI amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT70V7339S166DDI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT70V7339S166DDI


Memory Intersil (Renesas Electronics Corporation) IDT70V7339S166DDI Overview

The Memory Intersil (Renesas Electronics Corporation) IDT70V7339S166DDI SRAM offers a high-capacity storage solution of 9Mbit, integrated in a compact 144TQFP package. This component is engineered for high-speed performance and reliability, making it an excellent choice for applications requiring rapid access to large volumes of data. Its parallel interface ensures efficient data handling and throughput, essential for demanding computational tasks in industrial and commercial environments. The strategic design and technical capabilities of the IDT70V7339S166DDI make it highly desirable for businesses looking to scale their operations with robust, performance-oriented memory components.

IDT70V7339S166DDI Features

This SRAM chip boasts a large 9Mbit storage capacity, encapsulated in a thermally efficient 144TQFP package that aids in maintaining optimal operational temperatures. Its parallel interface architecture facilitates quick and efficient data transfer rates, essential for high-performance computing tasks. The IDT70V7339S166DDI is also designed for low power consumption, enhancing its suitability for energy-sensitive applications while maintaining high data integrity and access speed.

IDT70V7339S166DDI Applications

  • Telecommunications Equipment: Utilized in routers and switches for buffering and data storage, improving bandwidth and reducing latency.
  • High-Performance Computing: Serves as temporary storage for processing large datasets rapidly, crucial in simulations and data analysis.
  • Industrial Automation: Used in control systems requiring quick access to data for real-time process management and operational control.
  • Networking Hardware: Enhances data throughput in network cards and modems, supporting faster communication protocols.
  • Consumer Electronics: Integrates into devices like set-top boxes and gaming consoles, where speed and reliability enhance user experience.
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Shipping Cost

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