IDT70V7339S166DD
- Mfr.Part #
- IDT70V7339S166DD
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- 144-LQFP Exposed Pad
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 144TQFP
- Stock
- 15,899
- In Stock :
- 15,899
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Access Time :
- 3.6ns
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Clock Frequency :
- 166MHz
- Memory Interface :
- Parallel
- RoHS Status :
- Non-RoHS Compliant
- Base Part Number :
- IDT70V7339
- Operating Temperature :
- 0°C~70°C TA
- Package / Case :
- 144-LQFP Exposed Pad
- Supplier Device Package :
- 144-TQFP (20x20)
- Memory Type :
- Volatile
- Voltage - Supply :
- 3.15V~3.45V
- Memory Format :
- SRAM
- Packaging :
- Tray
- Memory Size :
- 9Mb 512K x 18
- Datasheets
- IDT70V7339S166DD

Memory Intersil (Renesas Electronics Corporation) IDT70V7339S166DD Overview
The Memory Intersil (Renesas Electronics Corporation) IDT70V7339S166DD is a cutting-edge SRAM component designed for high-performance computing systems requiring rapid access to large amounts of data. With a storage capacity of 9Mbit and housed in a compact 144TQFP package, this SRAM is engineered for applications where speed and reliability are paramount. Its parallel interface ensures quick data transfer rates, making it an ideal solution for advanced telecommunications infrastructure, high-speed computing, and critical real-time processing tasks. The product's robust design and advanced manufacturing from Renesas ensure optimal functionality and durability, positioning it as a preferred choice for businesses aiming to leverage high-speed memory in their systems.
IDT70V7339S166DD Features
This SRAM chip boasts several features that make it highly suitable for a range of demanding applications. It offers a large 9Mbit capacity, enabling efficient handling of extensive data sets. The parallel communication interface facilitates swift data access and transfer, crucial for performance-critical applications. Additionally, its 144TQFP packaging is designed for minimal space usage while providing maximum reliability and heat dissipation, an essential factor for maintaining stability and performance in dense electronic environments.
IDT70V7339S166DD Applications
- Advanced Networking Equipment: Utilized in routers and switches to manage buffer memory for high-speed data transfers and real-time packet processing.
- High-Performance Computing: Acts as temporary storage for quick data retrieval in supercomputing nodes to accelerate computational tasks and algorithms.
- Telecommunications: Supports telecommunications infrastructure by providing rapid access memory for signal processing tasks critical in base stations and network interfaces.
- Industrial Automation: Enhances control systems by storing configuration data and real-time process information, ensuring swift system response and operational reliability.
- Aerospace and Defense: Used in mission-critical military and aerospace applications, where reliability and data integrity are crucial under extreme conditions.
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