IDT70V7339S133DD

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Mfr.Part #
IDT70V7339S133DD
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
144-LQFP Exposed Pad
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 144TQFP
Stock
6,909
In Stock :
6,909

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Memory Type :
Volatile
Memory Interface :
Parallel
Clock Frequency :
133MHz
Packaging :
Tray
Memory Size :
9Mb 512K x 18
Mounting Type :
Surface Mount
Voltage - Supply :
3.15V~3.45V
Operating Temperature :
0°C~70°C TA
Access Time :
4.2ns
Supplier Device Package :
144-TQFP (20x20)
Package / Case :
144-LQFP Exposed Pad
Base Part Number :
IDT70V7339
RoHS Status :
Non-RoHS Compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
SRAM
Datasheets
IDT70V7339S133DD
Introducing Memory Intersil (Renesas Electronics Corporation) IDT70V7339S133DD from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Package / Case:144-LQFP Exposed Pad, Base Part Number:IDT70V7339, IDT70V7339S133DD pinout, IDT70V7339S133DD datasheet PDF, IDT70V7339S133DD amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT70V7339S133DD ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT70V7339S133DD


Memory Intersil (Renesas Electronics Corporation) IDT70V7339S133DD Overview

The Memory Intersil (Renesas Electronics Corporation) IDT70V7339S133DD is a high-performance 9Mbit SRAM device, encapsulated in a compact 144-TQFP package. This integrated circuit is designed to meet the demanding needs of advanced telecommunications and computing systems, providing high-speed, low-latency data storage and retrieval. With its parallel interface, it ensures compatibility with a wide range of existing technologies, making it an ideal solution for developers looking to upgrade their systems without compromising on performance or design scalability.

IDT70V7339S133DD Features

This SRAM component boasts several features that enhance its suitability for high-speed computing environments. Key features include its large 9Mbit storage capacity, fast access times, and the reliability of a well-established manufacturer like Intersil (Renesas Electronics Corporation). The 144-TQFP packaging not only offers robust protection for the IC but also facilitates easier mounting and integration into PCBs, aiding in heat dissipation and maintaining signal integrity even under strenuous operational conditions.

IDT70V7339S133DD Applications

  • Networking Equipment: Utilized in routers and switches, where high-speed data buffering is critical to manage large volumes of traffic efficiently.
  • Telecommunications Infrastructure: Deployed in telecommunications systems to provide quick access to buffer memory, which is essential for handling high-speed signal processing and data exchange.
  • High-performance Computing: Ideal for use in servers and supercomputers that require rapid access to large amounts of data for real-time processing and analysis.
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