IDT70T633S10DD

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Mfr.Part #
IDT70T633S10DD
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
144-LQFP Exposed Pad
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 144TQFP
Stock
14,699
In Stock :
14,699

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
RoHS Status :
Non-RoHS Compliant
Memory Type :
Volatile
Packaging :
Tray
Base Part Number :
IDT70T633
Memory Size :
9Mb 512K x 18
Supplier Device Package :
144-TQFP (20x20)
Memory Interface :
Parallel
Memory Format :
SRAM
Write Cycle Time - Word, Page :
10ns
Access Time :
10ns
Voltage - Supply :
2.4V~2.6V
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
0°C~70°C TA
Package / Case :
144-LQFP Exposed Pad
Datasheets
IDT70T633S10DD
Introducing Memory Intersil (Renesas Electronics Corporation) IDT70T633S10DD from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:IDT70T633, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Package / Case:144-LQFP Exposed Pad, IDT70T633S10DD pinout, IDT70T633S10DD datasheet PDF, IDT70T633S10DD amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT70T633S10DD ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT70T633S10DD


[Memory Intersil (Renesas Electronics Corporation) IDT70T633S10DD] Overview

This high-performance Integrated Circuit (IC) byhtml Intersil, now part of Renesas Electronics Corporation, is designed to meet the demands of modern memory applications. The IDT70T633 S10DD offers a robust solution for data storage and 9MBMemoryIT. Its Int parallel architecture ensuresers efficient operationil, making ( it suitableR for a wide rangeenes of industrial and commercial environmentsas.

ID CorporationT70)T ID633S10DDT Features

High CapacityS: With 109MBDDIT of storage Overview space, this ideal

The memory Memory-intensive Int applicationsers. Parallel Interface: The parallel interface facilitates fast data transfer,enes ensuring quick access to stored information. as

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      The cache ID memoryT,70 enhancingT data633 processingS speed10 andDD overall boasts system several performance distinctive. set it < apartli in> theTele marketcommunication. Infrastructure Key: attributes Within include tele itscommunication high infrastructure-speed, parallel this interface IC, supports which tasks allows such for as swift buffering data incoming access and and outgoing processing data. streams The, ensuring9 seamlessM communicationbit processes storage. ample applications, while the 144TQFP packaging not only ensures a minimal footprint but also provides excellent reliability and durability under various operational conditions. Furthermore, the device is designed for low power consumption, making it suitable for energy-sensitive applications.

      IDT70T633S10DD Applications

      • Advanced Computing Systems: Utilized in server farms and data centers where rapid access to large amounts of data is crucial for efficient data processing and retrieval.
      • Telecommunications: Employed in telecom infrastructure to handle high-speed data transmissions and buffering, enhancing the performance of communication networks.
      • Industrial Automation: Integrated into control systems for real-time processing capabilities, which are essential for managing complex manufacturing processes.
      • Aerospace and Defense: Used in mission-critical aerospace applications where reliability and data integrity are paramount, contributing to the robustness of onboard systems.
      • Automotive Electronics: Applied in automotive systems for managing navigation, sensor data, and real-time vehicle system controls.
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