IDT70P3307S250RM

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Mfr.Part #
IDT70P3307S250RM
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
576-BBGA, FCBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 576FCBGA
Stock
42,145
In Stock :
42,145

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Memory Interface :
Parallel
Packaging :
Tray
Operating Temperature :
0°C~70°C TA
Memory Type :
Volatile
Clock Frequency :
250MHz
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Mounting Type :
Surface Mount
Base Part Number :
IDT70P3307
Memory Format :
SRAM
Memory Size :
18Mb 1M x 18
RoHS Status :
Non-RoHS Compliant
Package / Case :
576-BBGA, FCBGA
Voltage - Supply :
1.7V~1.9V
Access Time :
6.3ns
Datasheets
IDT70P3307S250RM
Introducing Memory Intersil (Renesas Electronics Corporation) IDT70P3307S250RM from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Base Part Number:IDT70P3307, Package / Case:576-BBGA, FCBGA, IDT70P3307S250RM pinout, IDT70P3307S250RM datasheet PDF, IDT70P3307S250RM amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT70P3307S250RM ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT70P3307S250RM


Memory Intersil (Renesas Electronics Corporation) IDT70P3307S250RM Overview

The Memory Intersil (Renesas Electronics Corporation) IDT70P3307S250RM is a high-performance 18Mbit SRAM module, engineered to meet the demands of sophisticated electronics systems requiring high-speed data access and reliability. Housed in a compact 576-FCBGA package, this IC SRAM offers seamless integration for a wide array of industrial and commercial applications. Its robust design and cutting-edge technology ensure optimal performance and durability, making it an ideal choice for businesses looking to enhance their electronic product offerings.

IDT70P3307S250RM Features

This Integrated Circuit boasts several key features that make it stand out in the competitive field of memory components. With a parallel interface, it allows for quick data access and processing speeds, essential for high-performance computing environments. The large 18Mbit capacity provides ample space for complex applications and data-intensive operations. The 576-FCBGA package is designed for efficient space utilization and enhanced thermal stability, ensuring reliable performance under various operating conditions.

IDT70P3307S250RM Applications

  • Networking Equipment: Utilized in routers and switches, the IDT70P3307S250RM enhances data buffering and throughput, ensuring efficient network management and improved data flow across multiple channels.
  • High-performance Computing: Ideal for use in servers and data centers, this SRAM facilitates faster data access and processing, crucial for reducing latency and boosting system efficiency.
  • Telecommunications: Supports the high-speed requirements of telecom infrastructure by providing rapid access and storage of information, crucial for real-time communication applications.
  • Aerospace and Defense: Due to its robust design and reliability, it is well-suited for applications in aerospace and defense, where data integrity and operational durability are paramount.
  • Medical Devices: Used in medical imaging and diagnostic equipment, helping in the rapid processing and storage of large volumes of patient data and imaging information, essential for timely and accurate diagnoses.
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Shipping Cost

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