IDT70P3307S233RMI

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Mfr.Part #
IDT70P3307S233RMI
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
576-BBGA, FCBGA
Datasheet
Download
Description
IC SRAM 18MBIT PAR 576FCBGA
Stock
37,984
In Stock :
37,984

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Memory Interface :
Parallel
Base Part Number :
IDT70P3307
Clock Frequency :
233MHz
Memory Size :
18Mb 1M x 18
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Memory Type :
Volatile
Memory Format :
SRAM
Packaging :
Tray
Voltage - Supply :
1.7V~1.9V
RoHS Status :
Non-RoHS Compliant
Package / Case :
576-BBGA, FCBGA
Mounting Type :
Surface Mount
Access Time :
7.2ns
Operating Temperature :
-40°C~85°C TA
Datasheets
IDT70P3307S233RMI
Introducing Memory Intersil (Renesas Electronics Corporation) IDT70P3307S233RMI from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:IDT70P3307, Package / Case:576-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, IDT70P3307S233RMI pinout, IDT70P3307S233RMI datasheet PDF, IDT70P3307S233RMI amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT70P3307S233RMI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT70P3307S233RMI


Memory Intersil (Renesas Electronics Corporation) IDT70P3307S233RMI Overview

The Memory Intersil (Renesas Electronics Corporation) IDT70P3307S233RMI is a high-performance 18Mbit SRAM device housed in a 576-pin FCBGA package. Engineered for optimal speed and reliability, this integrated circuit is designed to meet the rigorous demands of sophisticated electronic systems. With its parallel interface, it offers fast data access rates, making it ideal for applications requiring high-speed data storage and retrieval. The robust design and manufacturing expertise of Intersil ensure that this memory component provides consistent, reliable performance under a wide range of environmental conditions, appealing to businesses looking for bulk purchasing of reliable memory solutions.

IDT70P3307S233RMI Features

This integrated circuit boasts a large storage capacity of 18Mbit, packaged in a compact 576-pin FCBGA layout. It features high-speed parallel interface capabilities, ensuring quick read and write operations which are essential for high-performance computing applications. The device is designed for low-power consumption, making it an excellent choice for power-sensitive applications.

IDT70P3307S233RMI Applications

  • Advanced Telecommunications

    In telecom systems, the IDT70P3307S233RMI serves as high-speed buffer memory for managing large volumes of data transfers, enhancing the efficiency of data handling in communication infrastructures.

  • Networking Equipment

    Used in routers and switches, this SRAM helps in managing routing tables and buffering data packets, which improves the overall speed and reliability of network communications.

  • High-Performance Computing (HPC)

    This memory chip supports the needs of HPC applications by providing fast data access needed for processing large datasets quickly and efficiently.

  • Automotive Systems

    In automotive applications, the IDT70P3307S233RMI is used for data logging and real-time system analysis, crucial for advanced driver-assistance systems (ADAS).

  • Industrial Automation

    This SRAM is utilized in industrial control systems where quick data retrieval is necessary for real-time process control and monitoring.

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Shipping Method

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Shipping Cost

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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

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