IDT70825L35PF8

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Mfr.Part #
IDT70825L35PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
80-LQFP
Datasheet
Download
Description
IC RAM 128KBIT PARALLEL 80TQFP
Stock
46,552
In Stock :
46,552

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Base Part Number :
IDT70825
Voltage - Supply :
4.5V~5.5V
Supplier Device Package :
80-TQFP (14x14)
Access Time :
35ns
Memory Interface :
Parallel
Memory Type :
Volatile
Package / Case :
80-LQFP
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tape and Reel (TR)
Memory Format :
RAM
RoHS Status :
Non-RoHS Compliant
Memory Size :
128Kb 8K x 16
Operating Temperature :
0°C~70°C TA
Write Cycle Time - Word, Page :
35ns
Mounting Type :
Surface Mount
Datasheets
IDT70825L35PF8
Introducing Memory Intersil (Renesas Electronics Corporation) IDT70825L35PF8 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:IDT70825, Package / Case:80-LQFP, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, IDT70825L35PF8 pinout, IDT70825L35PF8 datasheet PDF, IDT70825L35PF8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT70825L35PF8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT70825L35PF8


Memory Intersil (Renesas Electronics Corporation) IDT70825L35PF8 Overview

The Memory Intersil (Renesas Electronics Corporation) IDT70825L35PF8 is a high-performance Integrated Circuit (IC) featuring a 128Kbit parallel RAM packed into a compact 80TQFP package. This component is engineered to meet the demands of applications requiring high-speed data retrieval and storage. The integration of advanced IC technology from Intersil, now a part of Renesas Electronics Corporation, ensures reliable performance and enhanced data integrity, making it an ideal choice for sophisticated electronic systems. The component's robust design and advanced fabrication techniques make it a valuable asset for businesses looking to enhance system performance while maintaining cost efficiency.

IDT70825L35PF8 Features

The IDT70825L35PF8 RAM module offers various features that make it stand out in the realm of electronic components. Key features include its parallel interface, which allows for faster data access compared to serial interfaces. The chip operates efficiently within a broad temperature range, ensuring reliability under varying environmental conditions. Additionally, its low-power consumption makes it suitable for power-sensitive applications, and its compact 80TQFP packaging ensures a minimal footprint on system boards, facilitating more streamlined designs.

IDT70825L35PF8 Applications

  • Telecommunications: Utilized in communication infrastructure to handle fast data buffering and signal processing, enhancing the performance and reliability of network systems.
  • Embedded Systems: Serves as a primary component in embedded applications for automotive and industrial controls, where quick access to data is crucial for real-time processing.
  • Computing: Used in high-speed computing applications, including servers and high-performance PCs, where large volumes of data need to be accessed rapidly and reliably.
  • Consumer Electronics: Integrated into consumer electronics such as gaming consoles and high-definition televisions, improving user experience through enhanced processing speed and data integrity.
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Shipping Cost

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