HT18LG-G
- Mfr.Part #
- HT18LG-G
- Manufacturer
- Microchip Technology
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 8SOIC
- Stock
- 4,794
- In Stock :
- 4,794
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- Manufacturer :
- Microchip Technology
- Product Category :
- Telecom
- Seated Height-Max :
- 1.75 mm
- Mount :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Brand :
- Microchip Technology
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Reach Compliance Code :
- Compliant
- Number of Pins :
- 8
- Surface Mount :
- yes
- Interface :
- --
- Operating Supply Voltage :
- 6V
- Number of Functions :
- 1
- Base Part Number :
- HT18
- Package Type :
- SOIC N
- Terminal Pitch :
- 1.27 mm
- Base Product Number :
- HT18
- Includes :
- --
- Qualification Status :
- Not Qualified
- Subcategory :
- Switch ICs
- Weight :
- 540.001716mg
- Supplier Device Package :
- 8-SOIC
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Supply Voltage :
- 2.3V
- JESD-609 Code :
- e3
- RoHS :
- Compliant
- Product Category :
- Switch ICs - Various
- Pin Count :
- 8
- Package :
- Tape and Reel (TR)
- Length :
- 4.9mm
- Rad Hardened :
- No
- Voltage - Supply :
- --
- Terminal Position :
- Dual
- Mounting :
- Surface Mount
- Max Supply Voltage :
- 350V
- Number of Terminals :
- 8
- Mounting Style :
- SMD/SMT
- Function :
- Switch
- Terminal Form :
- Gull wing
- Product Type :
- Switch ICs - Various
- Packaging :
- Tape and Reel (TR)
- Number of Circuits :
- 1
- Current - Supply :
- --
- Product Status :
- Active
- Telecom IC Type :
- DIGITAL TIME SWITCH
- JESD-30 Code :
- R-PDSO-G8
- HTS Code :
- 8542.39.00.01
- Terminal Finish :
- MATTE TIN
- Peak Reflow Temperature (Cel) :
- 260
- Lifecycle Status :
- EOL (Last Updated: 2 years ago)
- Min Operating Temperature :
- 0 °C
- Series :
- --
- Max Operating Temperature :
- 50 °C
- Package Shape :
- RECTANGULAR
- Published :
- 2014
- Manufacturer :
- Microchip
- Product :
- Electronic Line Switches
- Number of Terminations :
- 8
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Factory Lead Time :
- 14 Weeks
- Max Power Dissipation :
- 800mW
- Operating Temperature :
- 0°C~50°C
- Width :
- 3.9mm
- Datasheets
- HT18LG-G

Telecom Microchip Technology HT18LG-G Overview
The Telecom Microchip Technology HT18LG-G is a sophisticated IC telecom interface designed to enhance telecommunications systems by providing robust interfacing solutions. This component, housed in a compact 8SOIC package, integrates seamlessly into modern telecom infrastructure, offering increased reliability and performance. The HT18LG-G is engineered to meet the rigorous demands of high-speed communication protocols, ensuring optimal efficiency and signal integrity in a range of telecommunications applications. With its advanced technology and Microchip Technology's renowned manufacturing quality, the HT18LG-G is an ideal choice for developers looking to improve system responsiveness and operational stability in telecom networks.
HT18LG-G Features
The HT18LG-G IC from Microchip Technology boasts a range of features designed to optimize telecom systems. Key features include its small footprint in an 8SOIC package, making it ideal for space-constrained applications. Additionally, it offers high integration to minimize external components and reduce system complexity. The interface IC also provides excellent signal integrity, critical for maintaining clear communication in high-speed telecom networks. Its robust design ensures long-term reliability even under the strenuous conditions typical of telecom environments.
HT18LG-G Applications
- Telecommunications Networks: The HT18LG-G can be used to interface with various telecommunications equipment, enhancing signal integrity and reliability in network operations.
- VoIP Systems: Ideal for Voice over Internet Protocol (VoIP) applications, this IC helps in managing data flow efficiently, ensuring clear and uninterrupted voice transmissions.
- Data Routers: In routers, the HT18LG-G assists in data packet processing, improving the handling and routing of large volumes of data across networks.
- Wireless Communication Systems: The IC enhances wireless modules by providing stable interfacing capabilities, crucial for maintaining robust wireless connections.
- Office Communication Systems: It is also applied in office telecom systems, where it supports multiple communication protocols, ensuring seamless interconnectivity among devices.
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