HMTSW-107-08-G-S-007

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Mfr.Part #
HMTSW-107-08-G-S-007
Manufacturer
Samtec, Inc.
Package / Case
Datasheet
Download
Description
CONN HEADER VERT 7POS 2.54MM
Stock
22,410
In Stock :
22,410

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Manufacturer :
Samtec, Inc.
Product Category :
Headers, Male Pins
Contact Finish Thickness - Mating :
10.0μin 0.25μm
Mount :
Through Hole
Fastening Type :
Push-Pull
Insulation Material :
Liquid Crystal Polymer (LCP)
Contact Finish - Mating :
Gold
Shrouding :
Unshrouded
Contact Length - Mating :
0.007 0.18mm
Operating Temperature :
-55°C~125°C
Contact Finish Thickness - Post :
3.00μin 0.076μm
MIL Conformance :
No
JESD-609 Code :
e4
Number of Positions Loaded :
All
Number of Rows :
1
Termination :
Solder
Number of Positions :
7
Style :
Board to Board or Cable
RoHS Status :
ROHS3 Compliant
Insulation Height :
0.100 2.54mm
Mixed Contacts :
No
DIN Conformance :
No
Contact Length - Post :
0.423 10.74mm
Mounting Type :
Through Hole
Overall Contact Length :
0.530 13.46mm
Option :
GENERAL PURPOSE
Radiation Hardening :
No
Contact Material :
Phosphor Bronze
Series :
Flex Stack, HMTSW
IEC Conformance :
No
Lead Pitch :
2.54mm
Pitch - Mating :
0.100 2.54mm
Filter Feature :
No
Contact Shape :
Square
Moisture Sensitivity Level (MSL) :
Not Applicable
Material Flammability Rating :
UL94 V-0
Current Rating (Amps) :
3A
Factory Lead Time :
3 Weeks
Gender :
Male
Packaging :
Bulk
Connector Type :
Header
Insulation Color :
Natural
Contact Type :
Male Pin
Lead Free :
Lead Free
Introducing Headers, Male Pins Samtec, Inc. HMTSW-107-08-G-S-007 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-55°C~125°C, Mounting Type:Through Hole, HMTSW-107-08-G-S-007 pinout, HMTSW-107-08-G-S-007 datasheet PDF, HMTSW-107-08-G-S-007 amp .Beyond Headers, Male Pins Samtec, Inc. HMTSW-107-08-G-S-007 ,we also offer 3220-20-0100-00, 3020-26-0300-00, 3220-26-0300-00-TR, Our vast inventory has you covered. Contact us now for immediate solutions.



Flex Stack, HMTSW Series 1-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 7-Position Board to Board or Cable 0.100 2.54mm Height

HMTSW-107-08-G-S-007 Overview


The product is packaged in Header.This device is mounted in the Through Hole position.It has been determined that a Bulk case is necessary to package the product.There is a product in the Flex Stack, HMTSW Series.Part Through Hole is mounted to the part.As a result, the device runs at -55°C~125°C Operating Temperature.

HMTSW-107-08-G-S-007 Features


Flex Stack, HMTSW series


HMTSW-107-08-G-S-007 Applications


There are a lot of Samtec Inc.
HMTSW-107-08-G-S-007 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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Payment Method

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IMPORTANT NOTICE

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Shipping Cost

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