HIF7CA-80PA-1.27DSAL(71)

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Mfr.Part #
HIF7CA-80PA-1.27DSAL(71)
Manufacturer
Hirose
Package / Case
Datasheet
Download
Description
CONN HDR 80POS VERT GOLD
Stock
16,743
In Stock :
16,743

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Manufacturer :
Hirose
Product Category :
Arrays, Edge Type, Mezzanine (Board to Board)
RoHS Status :
RoHS Compliant
Contact Plating :
Gold
Packaging :
Bulk
Contact Finish :
Gold
Pitch :
0.050 1.27mm
Feature :
Board Lock
Connector Type :
Header, Center Strip Contacts
Number of Positions :
80
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Mounting Type :
Through Hole
Number of Rows :
2
Height Above Board :
0.394 10.00mm
Factory Lead Time :
10 Weeks
Mount :
Through Hole
Series :
HIF7C
Introducing Arrays, Edge Type, Mezzanine (Board to Board) Hirose HIF7CA-80PA-1.27DSAL(71) from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, HIF7CA-80PA-1.27DSAL(71) pinout, HIF7CA-80PA-1.27DSAL(71) datasheet PDF, HIF7CA-80PA-1.27DSAL(71) amp .Beyond Arrays, Edge Type, Mezzanine (Board to Board) Hirose HIF7CA-80PA-1.27DSAL(71) ,we also offer 5054761010, 5035481222, AXT510124, Our vast inventory has you covered. Contact us now for immediate solutions.



Header, Center Strip Contacts Bulk 2 Rows 0.050 1.27mm Through Hole 80 Positions HIF7C Gold

HIF7CA-80PA-1.27DSAL(71) Overview


This product is packaged in a Header, Center Strip Contacts box.An Bulk case is utilized for packaging the product.Through Hole indicates that the device is mounted.The product is a part of the HIF7C Series.It is possible to ensure that Board Lock remains constant during operation.This part must be mounted with a Through Hole socket.

HIF7CA-80PA-1.27DSAL(71) Features


HIF7C series
Package / Case: Bulk
Mounting Type:Through Hole


HIF7CA-80PA-1.27DSAL(71) Applications


There are a lot of Hirose Electric Co Ltd
HIF7CA-80PA-1.27DSAL(71) Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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