HDAF-15-08.0-S-13-1

Manufacturer :

Samtec, Inc.

Product Category :

Arrays, Edge Type, Mezzanine (Board to Board)

Series :

HD Mezz™ HDAF

Height Above Board :

0.414 10.51mm

DIN Conformance :

No

Durability :

100 Cycles

Packaging :

Tray

Mixed Contacts :

No

Body Depth :

0.414 inch

Stack Height (Mating) :

20mm 25mm

Plating Thickness :

30μin

Max Operating Temperature :

125°C

Dielectric Withstanding Voltage :

700VAC V

Contact Material :

Copper

MIL Conformance :

No

Min Operating Temperature :

-55°C

Mating Information :

MULTIPLE MATING PARTS AVAILABLE

Contact Pattern :

RECTANGULAR

Body Breadth :

0.886 inch

JESD-609 Code :

e3

Total Number of Contacts :

195

Body Length or Diameter :

1.887 inch

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Mount :

Surface Mount

Number of Positions :

195

Mounting Type :

Surface Mount

Connector Type :

High Density Array, Female

Insulation Resistance :

5000000000Ohm

Contact Finish :

Gold

Reliability :

COMMERCIAL

PCB Contact Pattern :

RECTANGULAR

REACH SVHC :

No SVHC

Insulation Material :

Liquid Crystal Polymer (LCP)

Color :

Black

IEC Conformance :

No

RoHS Status :

ROHS3 Compliant

Number of Conductors :

ONE

Current Rating :

2.3A

Contact Resistance :

19mOhm

Reference Standard :

UL

Factory Lead Time :

3 Weeks

Row Spacing :

2 mm

Lead Pitch :

1.2mm

Option :

GENERAL PURPOSE

Filter Feature :

No

Radiation Hardening :

No

Termination :

Solder

Contact Finish Thickness :

30.0μin 0.76μm

Number of Rows :

13

Rated Current (Signal) :

1.8A

Gender :

Receptacle

Pitch :

0.047 1.20mm

Feature :

Board Guide

Number Of PCB Rows :

13

Pbfree Code :

No

Voltage - Rated AC :

200V