HD6417750RF200V

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Mfr.Part #
HD6417750RF200V
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
208-BFQFP Exposed Pad
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 208HQFP
Stock
543
In Stock :
543

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Microcontrollers
Terminal Finish :
Tin/Bismuth (Sn/Bi)
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR, RISC
HTS Code :
8542.31.00.01
Speed :
200MHz
Manufacturer :
Renesas Electronics Corporation
Number of Terminals :
208
Package Shape :
Square
Length :
28 mm
JESD-609 Code :
e6
Integrated Cache :
yes
Address Bus Width :
26
Pin Count :
208
Reach Compliance Code :
Compliant
RAM Size :
48K x 8
Operating Temperature :
-20°C ~ 75°C (TA)
JESD-30 Code :
S-PQFP-G208
Technology :
CMOS
Core Size :
32-Bit Single-Core
Number of I/O :
28
Temperature Grade :
COMMERCIAL EXTENDED
Bit Size :
32
Surface Mount :
yes
EEPROM Size :
-
Boundary Scan :
yes
Product Status :
Obsolete
Width :
28 mm
Package :
Tray
Series :
SuperH® SH7750
Low Power Mode :
yes
Supplier Device Package :
208-HQFP (28x28)
Brand Name :
Renesas
Connectivity :
EBI/EMI, FIFO, SCI, SmartCard
Seated Height-Max :
3.56 mm
Core Processor :
SH-4
Peak Reflow Temperature (Cel) :
240
Mounting Type :
Surface Mount
Format :
Floating Point
ECCN Code :
3A991.A.2
Data Converters :
-
Oscillator Type :
External
Peripherals :
DMA, POR, WDT
Interfaces :
SCI
External Data Bus Width :
64
Terminal Pitch :
0.5 mm
Program Memory Size :
-
Program Memory Type :
ROMless
Base Product Number :
HD6417750
Qualification Status :
Not Qualified
Factory Lead Time :
1 Week
Data Bus Width :
32 bit
Package / Case :
208-BFQFP Exposed Pad
Terminal Position :
QUAD
Terminal Form :
Gull wing
Voltage - Supply (Vcc/Vdd) :
1.35V ~ 1.6V
Datasheets
HD6417750RF200V
Introducing Microcontrollers Intersil (Renesas Electronics Corporation) HD6417750RF200V from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-20°C ~ 75°C (TA), Mounting Type:Surface Mount, Package / Case:208-BFQFP Exposed Pad, HD6417750RF200V pinout, HD6417750RF200V datasheet PDF, HD6417750RF200V amp .Beyond Microcontrollers Intersil (Renesas Electronics Corporation) HD6417750RF200V ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) HD6417750RF200V


Microcontrollers Intersil (Renesas Electronics Corporation) HD6417750RF200V Overview

The Microcontrollers Intersil (Renesas Electronics Corporation) HD6417750RF200V is a robust 32-bit MCU without onboard ROM, housed in a 208HQFP package. This highly flexible microcontroller supports a variety of interfaces and boasts a powerful CPU that can handle complex algorithms and processing tasks with ease. It's designed for advanced applications requiring high-speed data processing and real-time responses. Ideal for engineers and developers looking for a scalable solution in critical systems, this microcontroller integrates seamlessly into various hardware configurations, making it a go-to choice for innovation in sophisticated electronics.

HD6417750RF200V Features

This 32-bit MCU is notable for its ROMless architecture, allowing for customized firmware development tailored to specific applications. The 208HQFP packaging ensures robust performance in a compact form factor, suitable for dense PCB layouts. Key features include high-speed processing capabilities, extensive interface support, and the flexibility offered by a ROMless setup which facilitates a wide range of uses in industrial and commercial applications.

HD6417750RF200V Applications

  • Industrial Automation: Utilized in the control systems of automated assembly lines, where high-speed and precision data handling is crucial for optimizing manufacturing processes.
  • Automotive Electronics: Deployed in automotive systems to manage engine functions, safety mechanisms, and in-car entertainment systems, enhancing both performance and reliability.
  • Medical Devices: Integral to the operation of medical diagnostic equipment, where accurate real-time processing is essential for monitoring and diagnostic purposes.
  • Telecommunication Infrastructure: Supports the backbone of telecom systems, facilitating rapid data transmission and high reliability in network operations.
  • Consumer Electronics: Used in the development of smart home devices, including automation controllers and security systems, which require efficient and reliable processing capabilities.
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