HC5517BCM

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Mfr.Part #
HC5517BCM
Manufacturer
Harris Corporation
Package / Case
Datasheet
Download
Description
RINGING SLIC FOR ISDN MODEM
Stock
3,873
In Stock :
3,873

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Manufacturer :
Harris Corporation
Product Category :
Telecom
Qualification Status :
Not Qualified
Telecom IC Type :
SLIC
Terminal Finish :
TIN LEAD
Manufacturer :
Rochester Electronics LLC
Pbfree Code :
No
JESD-30 Code :
S-PQCC-J28
HTS Code :
8542.39.00.01
Package Shape :
Square
Terminal Form :
J BEND
Temperature Grade :
COMMERCIAL EXTENDED
Number of Functions :
1
Reach Compliance Code :
Unknown
Terminal Position :
QUAD
JESD-609 Code :
e0
Number of Terminals :
28
Surface Mount :
yes
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Datasheets
HC5517BCM
Introducing Telecom Harris Corporation HC5517BCM from Chip IC,where excellence meets affordability. This product stands out with its HC5517BCM pinout, HC5517BCM datasheet PDF, HC5517BCM amp .Beyond Telecom Harris Corporation HC5517BCM ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Harris Corporation HC5517BCM


Telecom Harris Corporation HC5517BCM Overview

The Harris Corporation HC5517BCM is a state-of-the-art Ringing Subscriber Line Interface Circuit (SLIC) specifically designed for ISDN modems. This component integrates seamlessly into telecommunications equipment, offering superior performance in signal processing. The HC5517BCM is engineered to facilitate robust, high-speed digital communications, making it an essential element for ISDN-based systems. Its design reflects Harris Corporation's commitment to reliability and efficiency in telecom technology. Tailored for demanding environments, the Telecom Harris Corporation HC5517BCM ensures consistent operation and longevity, ideal for manufacturers looking to enhance the functionality of their communications equipment.

HC5517BCM Features

The HC5517BCM from Harris Corporation boasts several key features that set it apart in the telecommunications industry. These include high voltage operation capabilities, which ensure reliable performance across a range of network conditions. Additionally, the device features low power consumption, which is crucial for reducing operational costs in large-scale deployments. Its compact design allows for integration in space-constrained applications, while its compliance with international telecommunications standards ensures its versatility in global markets.

HC5517BCM Applications

  • ISDN Modems: Utilized primarily in Integrated Services Digital Network (ISDN) modems, the HC5517BCM enhances voice, data, and video transmission over traditional telephone networks, enabling higher speeds and improved reliability.
  • Telecommunication Networks: Critical for the backbone of modern telecommunication infrastructures, this SLIC can be deployed in network interfaces where stable and high-quality line conditions are necessary for data integrity and transmission clarity.
  • Enterprise Communication Systems: Suitable for use in enterprise-level communication systems, the HC5517BCM supports advanced voice services and data exchange, ensuring robust connectivity within corporate environments.
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Shipping Cost

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