HC5513BIP

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Mfr.Part #
HC5513BIP
Manufacturer
Intersil
Package / Case
22-DIP (0.400, 10.16mm)
Datasheet
Download
Description
SLIC, 2-4 CONVERSION, PDIP22
Stock
640
In Stock :
640

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Manufacturer :
Intersil
Product Category :
Telecom
Supplier Device Package :
22-PDIP
Surface Mount :
No
Qualification Status :
COMMERCIAL
Number of Functions :
1
Number of Circuits :
1
Reach Compliance Code :
Unknown
JESD-30 Code :
R-PDIP-T22
Package Shape :
RECTANGULAR
Terminal Position :
Dual
Telecom IC Type :
SLIC
Pbfree Code :
No
Current - Supply :
5.5mA
Package :
Bulk
Manufacturer :
Rochester Electronics LLC
Interface :
2-Wire, 4-Wire
Voltage - Supply :
±4.75V ~ 5.25V
Function :
Subscriber Line Interface Concept (SLIC)
Product Status :
Active
Neg Supply Voltage-Nom :
-5 V
Series :
-
Operating Temperature :
-40°C ~ 85°C
Temperature Grade :
Industrial
Mounting Type :
Through Hole
JESD-609 Code :
e0
Terminal Finish :
TIN LEAD
Terminal Form :
THROUGH-HOLE
Power (Watts) :
150 mW
Number of Terminals :
22
Package / Case :
22-DIP (0.400, 10.16mm)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Datasheets
HC5513BIP
Introducing Telecom Intersil HC5513BIP from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C ~ 85°C, Mounting Type:Through Hole, Package / Case:22-DIP (0.400, 10.16mm), HC5513BIP pinout, HC5513BIP datasheet PDF, HC5513BIP amp .Beyond Telecom Intersil HC5513BIP ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil HC5513BIP


Telecom Intersil HC5513BIP Overview

The Telecom Intersil HC5513BIP represents a state-of-the-art Subscriber Line Interface Circuit (SLIC), specifically engineered for robust 24-channel conversion applications. This premium IC, packaged in a PDIP22 format, ensures superior reliability and performance for advanced telecom infrastructures. Designed by Intersil, a leader in semiconductor solutions, the HC5513BIP is ideal for high-density applications requiring efficient power distribution and fault management. Its capabilities make it particularly suited for deployment in large-scale business environments, offering unmatched performance that supports massive volume purchases.

HC5513BIP Features

The HC5513BIP chip boasts several key features that enhance its utility in telecom and networking equipment. Key features include its robust voltage handling capability, high integration that supports 24 conversion channels in a single package, and improved power management technology. This reliability and high-channel density make it a crucial component in demanding telecom applications.

HC5513BIP Applications

  • Multi-Line Telecommunication Systems: Utilized in office PBX or large telecommunication systems to manage multiple phone lines, ensuring clear and reliable communication.
  • VoIP Gateways: Acts as the primary interface circuit in Voice over IP (VoIP) gateways, converting analog phone signals into digital for internet transmission.
  • Telecom Switching Equipment: Integrated into switching systems to handle the setup, supervision, breakdown, and information interchange of telephone calls.
This HTML code provides a professional, detailed product overview and application list for the Telecom Intersil HC5513BIP, structured to appeal to business clients looking to purchase in bulk.
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