GT11-8DP-2.8DS(70)

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Mfr.Part #
GT11-8DP-2.8DS(70)
Manufacturer
Hirose
Package / Case
Datasheet
Download
Description
CONN HEADER R/A 8POS 2.8MM
Stock
46,382
In Stock :
46,382

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Manufacturer :
Hirose
Product Category :
Headers, Male Pins
RoHS Status :
RoHS Compliant
Style :
Board to Cable/Wire
Connector Type :
Header
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Contact Shape :
Square
Number of Rows :
2
Contact Finish - Mating :
Tin
Contact Material :
Brass
Mounting Type :
Through Hole, Right Angle
Insulation Material :
Polybutylene Terephthalate (PBT)
Contact Type :
Male Pin
Number of Positions :
8
Series :
GT11
Row Spacing - Mating :
0.161 (4.10mm)
Feature :
Mounting Flange
Termination :
Solder
Factory Lead Time :
10 Weeks
Shrouding :
Shrouded - 4 Wall
Pitch - Mating :
0.110 2.80mm
Reach Compliance Code :
Unknown
Contact Length - Post :
0.118 3.00mm
Packaging :
Bulk
Fastening Type :
Latch Holder
ECCN Code :
EAR99
Number of Positions Loaded :
All
Datasheets
GT11-8DP-2.8DS(70)
Introducing Headers, Male Pins Hirose GT11-8DP-2.8DS(70) from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Right Angle, GT11-8DP-2.8DS(70) pinout, GT11-8DP-2.8DS(70) datasheet PDF, GT11-8DP-2.8DS(70) amp .Beyond Headers, Male Pins Hirose GT11-8DP-2.8DS(70) ,we also offer 3220-20-0100-00, 3020-26-0300-00, 3220-26-0300-00-TR, Our vast inventory has you covered. Contact us now for immediate solutions.



GT11 Series 2-Row Header Solder Brass Bulk Through Hole, Right Angle Tin Polybutylene Terephthalate (PBT) 8-Position Board to Cable/Wire

GT11-8DP-2.8DS(70) Overview


The product comes in a package of Header.Through Hole, Right Angle is the type of mounting for the device.To package the product, a Bulk case is used.The product is a member of the GT11 Series.It is more powerful in many ways due to its Mounting Flange feature.

GT11-8DP-2.8DS(70) Features


GT11 series


GT11-8DP-2.8DS(70) Applications


There are a lot of Hirose Electric Co Ltd
GT11-8DP-2.8DS(70) Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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