GS832136AGD-333I

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Mfr.Part #
GS832136AGD-333I
Manufacturer
GSI Technology
Package / Case
BGA-165
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165FPBGA
Stock
21,706
In Stock :
21,706

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Manufacturer :
GSI Technology
Product Category :
Memory
Supply Voltage-Max (Vsup) :
2.7 V
Timing Type :
SYNCHRONOUS
Minimum Operating Temperature :
- 40 C
Minimum Operating Supply Voltage :
2.3, 3 V
Memory Density :
37748736 bit
Temperature Grade :
Industrial
HTS Code :
8542.32.00.41
Terminal Form :
Ball
Mounting :
Surface Mount
Data Rate Architecture :
SDR
Interface Type :
Parallel
Operating Mode :
SYNCHRONOUS
Screening Level :
Industrial
Surface Mount :
yes
Memory Width :
36
Brand :
GSI Technology
Power Supplies :
2.5/3.3 V
Width :
13 mm
Number of Functions :
1
Base Product Number :
GS832136
Memory Size :
36 Mbit
Operating Temperature :
-40 to 100 °C
Type :
Pipeline/Flow Through
Parallel/Serial :
Parallel
Organization :
1 M x 36
Qualification Status :
Not Qualified
Number of Words :
1 MWords
RoHS :
Details
Typical Operating Supply Voltage :
2.5, 3.3 V
Clock Frequency :
333 MHz
Maximum Operating Temperature :
+ 85 C
Reach Compliance Code :
Compliant
Number of Terminals :
165
Output Characteristics :
3-STATE
Standby Voltage-Min :
2.3 V
Write Cycle Time - Word, Page :
-
Mounting Style :
SMD/SMT
Maximum Clock Rate :
222.2@Flow-Through/333@Pipelined MHz
I/O Type :
COMMON
Supply Current-Max :
0.325 mA
Series :
GS832136AGD
Supply Voltage-Min (Vsup) :
2.3 V
Standby Current-Max :
0.04 A
Pin Count :
165
Product Status :
Active
Tradename :
SyncBurst
Factory Lead Time :
8 Weeks
Package Shape :
RECTANGULAR
Terminal Pitch :
1 mm
Supplier Package :
FBGA
Packaging :
Tray
Supplier Device Package :
165-FPBGA (13x15)
Product Category :
SRAM
Memory Interface :
Parallel
Package / Case :
BGA-165
Number of Ports :
4
Memory Format :
SRAM
Memory Organization :
1M x 36
Memory Type :
SDR
Terminal Position :
BOTTOM
Manufacturer :
GSI Technology
Number of I/O Lines :
36 Bit
Address Bus Width :
20 bit
Technology :
SRAM - Synchronous, Standard
JESD-30 Code :
R-PBGA-B165
Access Time :
4.5 ns
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Mounting Type :
Surface Mount
Voltage - Supply :
2.3V ~ 2.7V, 3V ~ 3.6V
Maximum Operating Supply Voltage :
2.7, 3.6 V
Memory IC Type :
CACHE SRAM
Subcategory :
Memory and Data Storage
Additional Feature :
PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY
ECCN Code :
3A991.B.2.B
Package :
Tray
Density :
36 Mbit
Length :
15 mm
Seated Height-Max :
1.4 mm
Architecture :
Flow-Through/Pipelined
Product Type :
SRAM
Datasheets
GS832136AGD-333I
Introducing Memory GSI Technology GS832136AGD-333I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40 to 100 °C, Type:Pipeline/Flow Through, Package / Case:BGA-165, Mounting Type:Surface Mount, GS832136AGD-333I pinout, GS832136AGD-333I datasheet PDF, GS832136AGD-333I amp .Beyond Memory GSI Technology GS832136AGD-333I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

GSI Technology GS832136AGD-333I


Memory GSI Technology GS832136AGD-333I Overview

The Memory GSI Technology GS832136AGD-333I is an advanced high-speed Integrated Circuit SRAM device featuring a substantial 36Mbit storage capacity, tailored for applications requiring rapid access and high data throughput. Manufactured by GSI Technology, this memory module utilizes a parallel interface encapsulated in a 165FPBGA package, ensuring robust performance and reliable integration into sophisticated electronic systems. Its design is optimized for minimal latency and high endurance, making it an ideal choice for critical applications across various industries. This product stands out in the market due to its blend of capacity, performance, and packaging efficiency, aiming to meet the demanding requirements of B2B customers looking for bulk purchasing options.

GS832136AGD-333I Features

The GS832136AGD-333I offers a range of features designed to enhance its usability and functionality in demanding applications. These include a high-speed parallel interface, a dense 36MB storage capacity in a compact 165FPBGA package, and low power consumption for enhanced thermal management. Additionally, its high data integrity and error correction capabilities make it exceptionally reliable in environments where data security and accuracy are paramount.

GS832136AGD-333I Applications

  • Networking Equipment: Utilized in routers, switches, and other network infrastructure to facilitate fast and reliable data cache and buffer management, enhancing overall network performance.
  • High-Performance Computing: Critical for use in servers and supercomputers where rapid access to large amounts of data is necessary for efficient processing and computation.
  • Telecommunications: Employed in telecommunications infrastructure to support high-speed data transmission and processing, ensuring robust and uninterrupted service delivery.
  • Aerospace and Defense: Integral to systems requiring high-reliability memory storage, capable of operating in extreme environmental conditions without data integrity compromise.
  • Medical Equipment: Used in medical diagnostic equipment for fast processing of large data sets, such as imaging data, contributing to timely and accurate diagnostics.
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