GS8182T18BGD-300I

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Mfr.Part #
GS8182T18BGD-300I
Manufacturer
GSI Technology
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FPBGA
Stock
16,918
In Stock :
16,918

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Manufacturer :
GSI Technology
Product Category :
Memory
Peak Reflow Temperature (Cel) :
260
Terminal Pitch :
1 mm
Typical Operating Supply Voltage :
1.8000 V
Package Shape :
RECTANGULAR
Number of I/O Lines :
18 Bit
Memory Organization :
1M x 18
Screening Level :
Industrial
Operating Mode :
SYNCHRONOUS
Operating Temperature :
-40 to 85 °C
Supply Voltage-Max (Vsup) :
1.9 V
Surface Mount :
yes
Timing Type :
SYNCHRONOUS
Operating Supply Voltage :
1.8 V
Width :
13 mm
Address Bus Width :
20 bit
Length :
15 mm
Product Status :
Active
Memory Type :
Volatile
Organization :
1MX18
Mounting :
Surface Mount
Package / Case :
165-LBGA
Terminal Position :
BOTTOM
Max Operating Temperature :
85 °C
Pin Count :
165
RoHS :
Compliant
Qualification Status :
Not Qualified
Architecture :
Pipelined
Write Cycle Time - Word, Page :
-
Supplier Device Package :
165-FPBGA (15x13)
Memory Width :
18
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
ECCN Code :
3A991.B.2.B
Number of Ports :
1
Manufacturer :
GSI Technology
Clock Frequency :
300 MHz
Memory Size :
18Mbit
Reach Compliance Code :
Compliant
Temperature Grade :
Industrial
Memory Format :
SRAM
Pbfree Code :
yes
Factory Lead Time :
7 Weeks
Terminal Form :
Ball
Min Operating Temperature :
-40 °C
Maximum Operating Supply Voltage :
1.9 V
Minimum Operating Supply Voltage :
1.7 V
Parallel/Serial :
Parallel
Voltage - Supply :
1.7V ~ 1.9V
Series :
-
Number of Words :
1 MWords
Number of Functions :
1
Mounting Type :
Surface Mount
Memory IC Type :
DDR SRAM
Seated Height-Max :
1.4 mm
JESD-609 Code :
e1
Additional Feature :
PIPELINED ARCHITECTURE, LATE WRITE
Radiation Hardening :
No
Supply Voltage-Min (Vsup) :
1.7 V
Maximum Clock Rate :
300 MHz
Data Rate Architecture :
DDR
HTS Code :
8542.32.00.41
Supplier Package :
FBGA
Package :
Tray
Density :
18 Mbit
Memory Interface :
Parallel
Number of Terminals :
165
Technology :
SRAM - Synchronous, DDR II
JESD-30 Code :
R-PBGA-B165
Memory Density :
18874368 bit
Base Product Number :
GS8182T18
Datasheets
GS8182T18BGD-300I
Introducing Memory GSI Technology GS8182T18BGD-300I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40 to 85 °C, Package / Case:165-LBGA, Mounting Type:Surface Mount, GS8182T18BGD-300I pinout, GS8182T18BGD-300I datasheet PDF, GS8182T18BGD-300I amp .Beyond Memory GSI Technology GS8182T18BGD-300I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

GSI Technology GS8182T18BGD-300I


Memory GSI Technology GS8182T18BGD-300I Overview

Introducing the Memory GSI Technology GS8182T18BGD-300I, a high-performance IC SRAM from GSI Technology, designed to meet the demanding specifications of advanced electronics systems. With a substantial 18Mbit capacity and a fast parallel interface encapsulated in a compact 165FPBGA package, this memory chip offers robust data integrity and speed, crucial for applications requiring high-volume and rapid access to data. Its thermal and operational reliability under various conditions make it an optimal choice for designers looking to enhance system performance while maintaining cost efficiency.

GS8182T18BGD-300I Features

This SRAM chip boasts several features that make it highly suitable for critical applications:

  • 18Mbit high-density integrated circuit memory
  • Parallel interface for rapid data access
  • Compact 165FPBGA packaging suitable for space-sensitive applications
  • Designed for high reliability and superior performance
  • Operational in a broad range of temperatures, ensuring stability in variable environments

GS8182T18BGD-300I Applications

  • Advanced Telecommunications: Used in routers and switches for buffer memory, enhancing data flow management and speed.
  • High-Performance Computing: Acts as cache memory in servers and supercomputers, enabling quicker access to frequently used data, thus speeding up computation times.
  • Aerospace and Defense: Integrates into avionics for real-time processing needs, where rapid data retrieval is crucial for mission-critical operations.
  • Medical Imaging Systems: Supports complex medical diagnostic equipment like MRI machines, where large amounts of data need to be processed swiftly to produce high-resolution images.
  • Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to process and store sensor data quickly, crucial for real-time decision making.
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