GS8182T18BGD-300I
- Mfr.Part #
- GS8182T18BGD-300I
- Manufacturer
- GSI Technology
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165FPBGA
- Stock
- 16,918
- In Stock :
- 16,918
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- Manufacturer :
- GSI Technology
- Product Category :
- Memory
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Pitch :
- 1 mm
- Typical Operating Supply Voltage :
- 1.8000 V
- Package Shape :
- RECTANGULAR
- Number of I/O Lines :
- 18 Bit
- Memory Organization :
- 1M x 18
- Screening Level :
- Industrial
- Operating Mode :
- SYNCHRONOUS
- Operating Temperature :
- -40 to 85 °C
- Supply Voltage-Max (Vsup) :
- 1.9 V
- Surface Mount :
- yes
- Timing Type :
- SYNCHRONOUS
- Operating Supply Voltage :
- 1.8 V
- Width :
- 13 mm
- Address Bus Width :
- 20 bit
- Length :
- 15 mm
- Product Status :
- Active
- Memory Type :
- Volatile
- Organization :
- 1MX18
- Mounting :
- Surface Mount
- Package / Case :
- 165-LBGA
- Terminal Position :
- BOTTOM
- Max Operating Temperature :
- 85 °C
- Pin Count :
- 165
- RoHS :
- Compliant
- Qualification Status :
- Not Qualified
- Architecture :
- Pipelined
- Write Cycle Time - Word, Page :
- -
- Supplier Device Package :
- 165-FPBGA (15x13)
- Memory Width :
- 18
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- ECCN Code :
- 3A991.B.2.B
- Number of Ports :
- 1
- Manufacturer :
- GSI Technology
- Clock Frequency :
- 300 MHz
- Memory Size :
- 18Mbit
- Reach Compliance Code :
- Compliant
- Temperature Grade :
- Industrial
- Memory Format :
- SRAM
- Pbfree Code :
- yes
- Factory Lead Time :
- 7 Weeks
- Terminal Form :
- Ball
- Min Operating Temperature :
- -40 °C
- Maximum Operating Supply Voltage :
- 1.9 V
- Minimum Operating Supply Voltage :
- 1.7 V
- Parallel/Serial :
- Parallel
- Voltage - Supply :
- 1.7V ~ 1.9V
- Series :
- -
- Number of Words :
- 1 MWords
- Number of Functions :
- 1
- Mounting Type :
- Surface Mount
- Memory IC Type :
- DDR SRAM
- Seated Height-Max :
- 1.4 mm
- JESD-609 Code :
- e1
- Additional Feature :
- PIPELINED ARCHITECTURE, LATE WRITE
- Radiation Hardening :
- No
- Supply Voltage-Min (Vsup) :
- 1.7 V
- Maximum Clock Rate :
- 300 MHz
- Data Rate Architecture :
- DDR
- HTS Code :
- 8542.32.00.41
- Supplier Package :
- FBGA
- Package :
- Tray
- Density :
- 18 Mbit
- Memory Interface :
- Parallel
- Number of Terminals :
- 165
- Technology :
- SRAM - Synchronous, DDR II
- JESD-30 Code :
- R-PBGA-B165
- Memory Density :
- 18874368 bit
- Base Product Number :
- GS8182T18
- Datasheets
- GS8182T18BGD-300I

Memory GSI Technology GS8182T18BGD-300I Overview
Introducing the Memory GSI Technology GS8182T18BGD-300I, a high-performance IC SRAM from GSI Technology, designed to meet the demanding specifications of advanced electronics systems. With a substantial 18Mbit capacity and a fast parallel interface encapsulated in a compact 165FPBGA package, this memory chip offers robust data integrity and speed, crucial for applications requiring high-volume and rapid access to data. Its thermal and operational reliability under various conditions make it an optimal choice for designers looking to enhance system performance while maintaining cost efficiency.
GS8182T18BGD-300I Features
This SRAM chip boasts several features that make it highly suitable for critical applications:
- 18Mbit high-density integrated circuit memory
- Parallel interface for rapid data access
- Compact 165FPBGA packaging suitable for space-sensitive applications
- Designed for high reliability and superior performance
- Operational in a broad range of temperatures, ensuring stability in variable environments
GS8182T18BGD-300I Applications
- Advanced Telecommunications: Used in routers and switches for buffer memory, enhancing data flow management and speed.
- High-Performance Computing: Acts as cache memory in servers and supercomputers, enabling quicker access to frequently used data, thus speeding up computation times.
- Aerospace and Defense: Integrates into avionics for real-time processing needs, where rapid data retrieval is crucial for mission-critical operations.
- Medical Imaging Systems: Supports complex medical diagnostic equipment like MRI machines, where large amounts of data need to be processed swiftly to produce high-resolution images.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to process and store sensor data quickly, crucial for real-time decision making.
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