FSI-110-06-L-D-E-AT

Manufacturer :

Samtec, Inc.

Product Category :

Arrays, Edge Type, Mezzanine (Board to Board)

Insulation Material :

Liquid Crystal Polymer (LCP)

Gender :

Male

Plating Thickness :

10μin

Reference Standard :

UL

Factory Lead Time :

3 Weeks

PCB Contact Pattern :

RECTANGULAR

ECCN Code :

EAR99

Connector Type :

Stacking Compression

IEC Conformance :

No

Body Breadth :

0.355 inch

Termination :

Solder

HTS Code :

8536.69.40.40

Contact Pattern :

RECTANGULAR

Body Length or Diameter :

0.949 inch

Contact Finish :

Gold

Number of Positions :

20

Additional Feature :

TOP SIDE ALIGNMENT PIN

Pbfree Code :

yes

DIN Conformance :

No

Mounting Option 2 :

Threaded

Reliability :

COMMERCIAL

RoHS Status :

ROHS3 Compliant

Feature :

Mating Guide, Mounting Flange

Series :

FSI

Filter Feature :

No

JESD-609 Code :

e3

Contact Finish Thickness :

10.0μin 0.25μm

Packaging :

Tube

Mounting Type :

Surface Mount

Board Mounting Option :

POSITIONING PIN

Body/Shell Style :

Receptacle

Height Above Board :

0.236 6.00mm

Option :

GENERAL PURPOSE

Polarization Key :

POLARIZED HOUSING

Number of Conductors :

ONE

Operating Temperature (Min) :

-65°C

Rated Current (Signal) :

1A

Number Of PCB Rows :

2

Radiation Hardening :

No

Pitch :

0.039 1.00mm

Mixed Contacts :

No

MIL Conformance :

No

Total Number of Contacts :

20

Number of Rows :

2

Contact Material :

BERYLLIUM COPPER

Moisture Sensitivity Level (MSL) :

1 (Unlimited)