FS32V234BMN1VUB

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Form :

Ball

Time@Peak Reflow Temperature-Max (s) :

40

Peak Reflow Temperature (Cel) :

260

Format :

Floating Point

Voltage - I/O :

1V 1.8V 3.3V

Display & Interface Controllers :

APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU

Number of Terminations :

621

RoHS Status :

ROHS3 Compliant

JESD-30 Code :

S-PBGA-B621

Published :

2015

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Security Features :

AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG

ECCN Code :

5A992

Ethernet :

1Gbps

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Factory Lead Time :

22 Weeks

Low Power Mode :

yes

Height Seated (Max) :

2.44mm

Package / Case :

621-FBGA, FCBGA

Terminal Position :

BOTTOM

Bit Size :

64

Surface Mount :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Core Processor :

ARM® Cortex®-A53, ARM® Cortex®-M4

Integrated Cache :

yes

Co-Processors/DSP :

Multimedia; NEON™ MPE

Boundary Scan :

yes

Length :

17mm

Speed :

800MHz

Graphics Acceleration :

yes

RAM Controllers :

DDR3, DDR3L, LPDDR2

Terminal Pitch :

0.65mm

Supply Voltage-Max (Vsup) :

1.05V

Operating Temperature :

-40°C~105°C TA

HTS Code :

8542.31.00.01

Supply Voltage :

1V

Supply Voltage-Min (Vsup) :

0.95V

Number of Cores/Bus Width :

4 Core 64-Bit/1 Core 32-Bit