FM22LD16-55-BGTR

Manufacturer :

Infineon Technologies

Product Category :

Memory

Memory Interface :

Parallel

Density :

4 Mb

HTS Code :

8542.32.00.71

ECCN Code :

EAR99

Write Cycle Time - Word, Page :

110ns

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Position :

BOTTOM

Memory Size :

4Mb 256K x 16

Factory Lead Time :

9 Weeks

Data Bus Width :

16b

JESD-609 Code :

e1

Memory Format :

FRAM

Number of Pins :

48

Memory Type :

Non-Volatile

Voltage - Supply :

2.7V~3.6V

Packaging :

Tape and Reel (TR)

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Operating Temperature :

-40°C~85°C TA

Organization :

256KX16

Package / Case :

48-TFBGA

Series :

F-RAM™

Base Part Number :

FM22LD16

Mounting Type :

Surface Mount

Height Seated (Max) :

1.2mm

Memory Width :

16

Supply Voltage-Max (Vsup) :

3.6V

Mount :

Surface Mount

Terminal Pitch :

0.75mm

Supply Voltage :

3.3V

Supply Voltage-Min (Vsup) :

2.7V

Operating Supply Voltage :

3.3V

Peak Reflow Temperature (Cel) :

260

Pin Count :

48

Nominal Supply Current :

12mA

Access Time (Max) :

55 ns

Qualification Status :

Not Qualified

Operating Mode :

ASYNCHRONOUS

RoHS Status :

ROHS3 Compliant

Number of Terminations :

48

Published :

2009

Number of Functions :

1

Standby Current-Max :

0.00015A

Length :

8mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Word Size :

16b