FLE-107-01-H-DV-P
- Mfr.Part #
- FLE-107-01-H-DV-P
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN RCPT 14POS 0.05 GOLD SMD
- Stock
- 40
- In Stock :
- 40
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Receptacles, Female Sockets
- Row Spacing - Mating :
- 0.050 (1.27mm)
- Mounting Type :
- Surface Mount
- Style :
- Board to Board or Cable
- Contact Shape :
- Square
- Operating Temperature :
- -55°C~125°C
- RoHS Status :
- ROHS3 Compliant
- Insulation Height :
- 0.172 4.37mm
- Contact Finish - Mating :
- Gold
- Fastening Type :
- Push-Pull
- Contact Material :
- Phosphor Bronze
- Number of Positions Loaded :
- All
- Connector Type :
- Receptacle
- Contact Finish Thickness - Post :
- 3.00μin 0.076μm
- Pitch - Mating :
- 0.050 1.27mm
- Contact Type :
- Female Socket
- Insulation Color :
- Black
- Number of Rows :
- 2
- Number of Positions :
- 14
- Series :
- FLE
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Termination :
- Solder
- Factory Lead Time :
- 3 Weeks
- Feature :
- Pick and Place
- Packaging :
- Tape and Reel (TR)
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Current Rating (Amps) :
- 2A per Contact
- Datasheets
- FLE-107-01-H-DV-P

2 Rows Receptacle Solder Phosphor Bronze Surface Mount Tape & Reel (TR) Gold Liquid Crystal Polymer (LCP) 14 Positions Female Socket
FLE-107-01-H-DV-P-TR Overview
You get it in Receptacle packaging.Mounting type Surface Mount is selected for the device.Packaged in a Tape & Reel (TR) case.A member of the FLE Series.This feature renders it more powerful in a number of ways because of its Pick and Place feature.Device runs in -55°C~125°C operating temperature.
FLE-107-01-H-DV-P-TR Features
FLE series
FLE-107-01-H-DV-P-TR Applications
There are a lot of Samtec Inc.
FLE-107-01-H-DV-P-TR Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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