FHG.1K.314.KLAC55

Manufacturer :

LEMO

Product Category :

Circular Connector Assemblies

Shielding :

Shielded

Current Rating (Amps) :

2A

Type :

TxRx + MCU

Power - Output :

-

Contact Finish - Mating :

Gold

Shell Size - Insert :

314

Contact Finish Thickness - Mating :

39.4µin (1.00µm)

Package / Case :

32-SMD Module

Operating Temperature :

-

Modulation :

4PSK, 8DPSK, GFSK

Orientation :

G

Connector Type :

Plug, Male Pins

Protocol :

Bluetooth v3.0 + EDR

Shell Material :

Brass

Number of Positions :

14

Product Status :

Obsolete

Sensitivity :

-

Color :

Black

Insert Material :

Polyetheretherketone (PEEK)

Supplier Device Package :

-

Voltage - Supply :

1.8V

Termination :

Solder Cup

Series :

-

Contact Material :

Brass

Ingress Protection :

IP66/IP68 - Dust Tight, Water Resistant, Waterproof

Cable Opening :

0.201 ~ 0.217 (5.10mm ~ 5.50mm)

Serial Interfaces :

I²C

Mounting Type :

Surface Mount

Applications :

-

Frequency :

2.4GHz

Backshell Material, Plating :

Brass, Black Chrome

Shell Size, MIL :

-

Shell Finish :

Black Chrome

Fastening Type :

Push-Pull, Detent Lock

Current - Transmitting :

-

Memory Size :

512MB Flash

Package :

Tray

Material Flammability Rating :

UL94 V-0

Features :

Backshell

Mounting Feature :

-

Data Rate (Max) :

-

Primary Material :

Metal

RF Family/Standard :

Bluetooth

Voltage Rating :

-

Current - Receiving :

-