ESW-117-33-L-D
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- Mfr.Part #
- ESW-117-33-L-D
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN SOCKET 34POS 0.1 GOLD PCB
- Stock
- 12
- In Stock ：
- 12
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Receptacles, Female Sockets
- Mating Contact Pitch :
- 0.1 inch
- Gender :
- Receptacle
- Mount :
- Through Hole
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Polarization Key :
- POLARIZED HOUSING
- Contact Material :
- Phosphor Bronze
- Contact Finish - Mating :
- Gold
- Series :
- ESW
- Mixed Contacts :
- No
- Number of Positions :
- 34
- RoHS Status :
- ROHS3 Compliant
- Operating Temperature :
- -55°C~125°C
- Pitch - Mating :
- 0.100 2.54mm
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Option :
- GENERAL PURPOSE
- IEC Conformance :
- No
- Mounting Type :
- Through Hole
- Packaging :
- Tube
- Plating Thickness :
- 10μin
- PCB Contact Pattern :
- RECTANGULAR
- Pbfree Code :
- yes
- Number Of PCB Rows :
- 2
- Contact Resistance :
- 10MOhm
- Filter Feature :
- No
- Number of Positions Loaded :
- All
- Reference Standard :
- UL, CSA
- Style :
- Board to Board
- Number of Rows :
- 2
- Insulation Color :
- Black
- MIL Conformance :
- No
- Termination :
- Solder
- Contact Type :
- Forked
- Material Flammability Rating :
- UL94 V-0
- Body Depth :
- 0.635 inch
- Length - Termination :
- 0.09 inch
- Contact Finish - Post :
- Tin
- Factory Lead Time :
- 3 Weeks
- JESD-609 Code :
- e3
- Number of Conductors :
- ONE
- Voltage - Rated :
- 550VAC
- Reliability :
- COMMERCIAL
- Insulation Height :
- 0.635 16.13mm
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Connector Type :
- Elevated Socket
- Contact Shape :
- Square
- DIN Conformance :
- No
- Body Breadth :
- 0.195 inch
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- Fastening Type :
- Push-Pull
- Contact Length - Post :
- 0.090 2.29mm
- Current Rating (Amps) :
- 5.2A per Contact
- Datasheets
- ESW-117-33-L-D
2 Rows Elevated Socket Solder Phosphor Bronze Through Hole Tube Gold Liquid Crystal Polymer (LCP) 34 Positions Forked
ESW-117-33-L-D Overview
The product is packaged in Elevated Socket.This device is mounted in the Through Hole position.It has been determined that a Tube case is necessary to package the product.There is a product in the ESW Series.Part Through Hole is mounted to the part.As a result, the device runs at -55°C~125°C Operating Temperature.
ESW-117-33-L-D Features
ESW series
ESW-117-33-L-D Applications
There are a lot of Samtec Inc.
ESW-117-33-L-D Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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