ESQ-109-37-S-D-LL
- Mfr.Part #
- ESQ-109-37-S-D-LL
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN SOCKET 18POS 0.1 GOLD PCB
- Stock
- 44,404
- In Stock :
- 44,404
Request A Quote(RFQ)
- * Fullname:
- * Company:
- * E-Mail:
- Phone:
- Comment:
- * Quantity:
- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Receptacles, Female Sockets
- Contact Resistance :
- 10MOhm
- Termination :
- Kinked Pin, Solder
- ECCN Code :
- EAR99
- Factory Lead Time :
- 3 Weeks
- Number Of PCB Rows :
- 2
- Material Flammability Rating :
- UL94 V-0
- Contact Material :
- Phosphor Bronze
- Style :
- Board to Board
- Mating Contact Pitch :
- 0.1 inch
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Pbfree Code :
- yes
- Body Depth :
- 0.435 inch
- Length - Termination :
- 0.09 inch
- Contact Shape :
- Square
- Contact Finish - Mating :
- Gold
- Contact Gender :
- FEMALE
- Insertion Force-Max :
- .9174 N
- Voltage - Rated :
- 550VAC
- Plating Thickness :
- 30μin
- Current Rating (Amps) :
- 5.7A per Contact
- HTS Code :
- 8536.69.40.40
- Number of Positions Loaded :
- All
- Connector Type :
- Elevated Socket
- Contact Finish - Post :
- Tin
- Reliability :
- COMMERCIAL
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Bulk
- Contact Length - Post :
- 0.090 2.29mm
- JESD-609 Code :
- e3
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- Withdrawl Force-Min :
- .7784 N
- Contact Type :
- Forked
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Number of Rows :
- 2
- Number of Conductors :
- ONE
- Number of Positions :
- 18
- Mounting Type :
- Through Hole
- Insulation Height :
- 0.435 11.05mm
- Body Breadth :
- 0.195 inch
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Insulation Color :
- Black
- Series :
- ESQ
- Reference Standard :
- UL, CSA
- Operating Temperature :
- -55°C~125°C
- Pitch - Mating :
- 0.100 2.54mm
- Fastening Type :
- Push-Pull
- PCB Contact Pattern :
- RECTANGULAR
- Datasheets
- ESQ-109-37-S-D-LL
ESQ-109-37-S-D-LL Documents
2 Rows Elevated Socket Kinked Pin, Solder Phosphor Bronze Through Hole Bulk Gold Liquid Crystal Polymer (LCP) 18 Positions Forked
ESQ-109-37-S-D-LL Overview
This product is packaged in a Elevated Socket box.Through Hole indicates that the device is mounted.An Bulk case is utilized for packaging the product.The product is a part of the ESQ Series.Operating temperature is set to -55°C~125°C.
ESQ-109-37-S-D-LL Features
ESQ series
ESQ-109-37-S-D-LL Applications
There are a lot of Samtec Inc.
ESQ-109-37-S-D-LL Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















