EPF10K50SBC356-3

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Mfr.Part #
EPF10K50SBC356-3
Manufacturer
Altera (Intel)
Package / Case
356-LBGA
Datasheet
Download
Description
IC FPGA 220 I/O 356BGA
Stock
7,662
In Stock :
7,662

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
360
Base Part Number :
EPF10K50
Packaging :
Tray
Supply Voltage :
2.5V
Voltage - Supply :
2.375V~2.625V
Power Supplies :
2.52.5/3.3V
Series :
FLEX-10KS®
Mounting Type :
Surface Mount
Terminal Finish :
Tin/Lead (Sn/Pb)
HTS Code :
8542.39.00.01
Time@Peak Reflow Temperature-Max (s) :
30
Output Function :
MIXED
JESD-30 Code :
S-PBGA-B356
Qualification Status :
Not Qualified
Number of Gates :
199000
Width :
35mm
Terminal Pitch :
1.27mm
Terminal Form :
Ball
Operating Temperature :
0°C~70°C TA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Length :
35mm
ECCN Code :
3A991
JESD-609 Code :
e0
Propagation Delay :
0.5 ns
Surface Mount :
yes
Number of I/O :
220
Peak Reflow Temperature (Cel) :
220
Number of Logic Elements/Cells :
2880
RoHS Status :
Non-RoHS Compliant
Reach Compliance Code :
Compliant
Number of Terminations :
356
Number of Inputs :
220
Programmable Logic Type :
LOADABLE PLD
Total RAM Bits :
40960
Package / Case :
356-LBGA
Height Seated (Max) :
1.63mm
Terminal Position :
BOTTOM
Number of Outputs :
220
Datasheets
EPF10K50SBC356-3
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EPF10K50SBC356-3 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:EPF10K50, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Number of Terminations:356, Package / Case:356-LBGA, EPF10K50SBC356-3 pinout, EPF10K50SBC356-3 datasheet PDF, EPF10K50SBC356-3 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EPF10K50SBC356-3 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EPF10K50SBC356-3


FPGAs Altera EPF10K50SBC356-3 Overview

The Altera EPF10K50SBC356-3, part of Intel’s sophisticated FPGA lineup, is designed to meet the growing needs of modern digital circuits. This high-performance Field Programmable Gate Array (FPGA) boasts a robust configuration with 220 I/O pins packed into a compact 356-ball grid array (BGA) package. The versatility and high integration level of the EPF10K50SBC356-3 make it an ideal choice for developers looking to implement complex logic structures and varied functionalities within a single chip, ensuring significant reductions in system costs and power consumption. With its ability to be programmed and re-programed post-production, this FPGA caters to a dynamic market where adaptation and efficiency are crucial.

EPF10K50SBC356-3 Features

The EPF10K50SBC356-3 FPGA from Altera (Intel) offers several key features that enhance its utility in sophisticated electronic applications. Key features include:

  • High density with 50,000 logic elements, allowing for complex and feature-rich designs.
  • 220 user I/O pins providing ample flexibility for interfacing with other components and systems.
  • Integrated DSP blocks to facilitate advanced digital signal processing.
  • Low power consumption, making it suitable for energy-sensitive applications.
  • Support for multiple design languages including VHDL and Verilog, ensuring ease of use for developers familiar with these tools.

EPF10K50SBC356-3 Applications

  • Communications Infrastructure: Utilized in routers and switchers for efficient data handling and increased processing capability.
  • Automotive Systems: Plays a critical role in automotive electronics for enhanced navigation, safety, and engine control functionalities.
  • Consumer Electronics: Integral in devices such as high-definition televisions and gaming consoles for optimized performance and functionality.
  • Industrial Automation: Enhances control systems in manufacturing environments for improved automation and process optimization.
  • Medical Devices: Used in medical imaging systems to process complex data and provide real-time results.
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