EPF10K30ABC356-4

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Mfr.Part #
EPF10K30ABC356-4
Manufacturer
Altera (Intel)
Package / Case
356-LBGA
Datasheet
Download
Description
IC FPGA 246 I/O 356BGA
Stock
8,614
In Stock :
8,614

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
3V~3.6V
Operating Temperature :
0°C~70°C TA
Number of LABs/CLBs :
216
Supplier Device Package :
356-BGA (35x35)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
246
Series :
FLEX-10KA®
Packaging :
Tray
Mounting Type :
Surface Mount
Number of Logic Elements/Cells :
1728
Package / Case :
356-LBGA
Number of Gates :
69000
Total RAM Bits :
12288
Datasheets
EPF10K30ABC356-4
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EPF10K30ABC356-4 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Package / Case:356-LBGA, EPF10K30ABC356-4 pinout, EPF10K30ABC356-4 datasheet PDF, EPF10K30ABC356-4 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EPF10K30ABC356-4 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EPF10K30ABC356-4


FPGAs Altera (Intel) EPF10K30ABC356-4 Overview

The Altera (Intel) EPF10K30ABC356-4 is a cutting-edge FPGA (Field Programmable Gate Array) designed to meet the demanding requirements of modern digital circuits. This versatile integrated circuit offers a robust platform for developing complex applications, owing to its high I/O count and substantial logic capacity. Manufactured by Altera, now part of Intel, this device ensures superior performance, flexibility, and efficiency, making it an ideal choice for high-volume applications in various industries. With 246 I/O pins packaged in a compact 356-ball grid array (BGA), the EPF10K30ABC356-4 provides ample connectivity options for even the most complex digital systems.

EPF10K30ABC356-4 Features

This FPGA features a high-density, 30,000 logic elements design, which is perfect for hardware acceleration, signal processing, and system management tasks. Its 356 BGA packaging ensures a minimal footprint while allowing for efficient heat dissipation and robust physical integration. Additional features include a built-in PLL for enhanced clock management, support for numerous logic standards, and programmable IOs, making it highly adaptable to new and legacy system designs.

EPF10K30ABC356-4 Applications

  • Telecommunications: Utilized in routers and switches for data packet processing and management, enhancing network efficiency and bandwidth capabilities.
  • Automotive Systems: Deployed in advanced driver-assistance systems (ADAS) to process real-time sensor data, improving vehicle safety and performance.
  • Consumer Electronics: Embedded in smart home devices for managing connectivity and automation tasks, thereby increasing the device intelligence and user interaction.
  • Industrial Automation: Used in control systems for manufacturing lines, enabling precise operations and real-time decision-making to boost productivity and reliability.
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