EPF10K250EFI672-3

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Mfr.Part #
EPF10K250EFI672-3
Manufacturer
Altera (Intel)
Package / Case
672-BBGA
Datasheet
Download
Description
IC FPGA 672FBGA
Stock
5,349
In Stock :
5,349

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Organization :
4 DEDICATED INPUTS, 470 I/O
Mounting Type :
Surface Mount
Number of Logic Cells :
12160
Supply Voltage-Min (Vsup) :
2.3V
Supply Voltage-Max (Vsup) :
2.7V
Terminal Finish :
TIN LEAD
Number of Dedicated Inputs :
4
Number of Terminations :
672
Package / Case :
672-BBGA
JESD-30 Code :
S-PBGA-B672
Surface Mount :
yes
Operating Temperature (Min) :
-40°C
Temperature Grade :
Industrial
Terminal Pitch :
1mm
Number of Inputs :
470
Supply Voltage :
2.5V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Reach Compliance Code :
Compliant
Terminal Form :
Ball
RoHS Status :
Non-RoHS Compliant
Packaging :
Tray
Programmable Logic Type :
LOADABLE PLD
HTS Code :
8542.39.00.01
Number of Outputs :
470
Number of I/O :
470
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Series :
FLEX-10KE®
Terminal Position :
BOTTOM
Operating Temperature (Max) :
85°C
Power Supplies :
2.52.5/3.3V
Output Function :
MIXED
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-609 Code :
e0
Qualification Status :
Not Qualified
Datasheets
EPF10K250EFI672-3
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EPF10K250EFI672-3 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:672, Package / Case:672-BBGA, EPF10K250EFI672-3 pinout, EPF10K250EFI672-3 datasheet PDF, EPF10K250EFI672-3 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EPF10K250EFI672-3 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EPF10K250EFI672-3


FPGAs Altera (Intel) EPF10K250EFI672-3 Overview

The FPGAs Altera (Intel) EPF10K250EFI672-3 is a highly versatile and powerful field programmable gate array (FPGA) designed for advanced applications requiring substantial logic integration and high-speed processing. Manufactured by Intel's Altera division, this IC is encapsulated in a 672-pin FBGA package, offering a robust platform for developing complex digital circuits with enhanced configurability and adaptability. With its extensive logic elements and high I/O pin count, this FPGA enables designers to achieve high levels of system integration and performance optimization in a single chip, making it ideal for both prototyping and mass production scenarios.

EPF10K250EFI672-3 Features

This FPGA features a high-density integration of up to 250K logic elements and embedded memory blocks, supporting a wide range of digital and mixed-signal applications. Its high-speed transceiver lanes ensure rapid data transfer rates, essential for high-performance computing and telecommunications. Additionally, the EPF10K250EFI672-3 supports various I/O standards, providing flexibility in interfacing with other digital systems, and is compatible with Intel's sophisticated Quartus II development environment, simplifying design processes and reducing time to market.

EPF10K250EFI672-3 Applications

  • Telecommunications: Utilized in routers and switches for data flow management and signal processing, enhancing network efficiency and bandwidth management.
  • Data Centers: Serves as the backbone for servers and storage systems, enabling high-speed data processing and large-scale system integration to meet the demands of cloud computing and big data analytics.
  • Automotive: Integrated into driver assistance systems and in-vehicle infotainment systems, providing the necessary computing power and connectivity for advanced vehicle automation and multimedia services.
  • Industrial Automation: Employs in control systems and machine vision applications to enhance operational efficiency and precision in automated manufacturing environments.
  • Aerospace and Defense: Used in satellite communications and avionics, ensuring robust performance and reliability under extreme conditions and critical applications.
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